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Formic Acid Series

Earlysun offers various solder paste products for electronic assembly, suitable for different application scenarios and processes, providing users with the most appropriate packaging solutions.

UV Adhesive

Product model chemical class Components Appearance Viscosity (mPa.s) Shear strength (Mpa) Tensile strength (Mpa) Hardness (Shore D) Product application
UV801 UV glue single component colorless transparent liquid 25000-35000 >10 >12 25-35 Circuit protection, chip protection, glass metal, ceramic plastic bonding, can also be used for potting protection of LCD glass.
uv801
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