Shenzhen Chenri Technology Co., Ltd.

G642 Leaded Solder Paste

G642 is a leaded solder paste developed by our company for high-precision SMT processes. Formulated with low-oxide Sn62.9Pb36.9Ag0.2 (Type 4 powder, melting point 183°C) alloy solder powder and ROM0 classified flux. The system incorporates high-performance thixotropic agents, providing superior wettability and continuous printability, suitable for fine-pitch components (QFP, etc.).

Features:

No-clean type, minimal residue after reflow soldering, low corrosivity, high surface insulation resistance.
Low volatile solvent system, wide operating window, good consistency in continuous printing, suitable for 0.3mm and finer pitch mounting.
Good thixotropy, resistant to slumping during and after printing, reducing the occurrence of solder bridging/shorts.
Good wetting performance, suitable for various reflow methods, resulting in full, good solder joints with high strength and excellent conductivity.

G624 Leaded Solder Paste

G624 is a leaded solder paste developed by our company for high-precision SMT process requirements. Formulated with low-oxide Sn62Pb36Ag2 (Type 4 powder, melting point 179°C) alloy solder powder and RAM classified flux. The system incorporates high-performance thixotropic agents, providing superior wettability and continuous printability, suitable for fine-pitch components (QFP, etc.).

Features:

No-clean type, minimal residue after reflow soldering, low corrosivity, high surface insulation resistance.
Low volatile solvent system, wide operating window, good consistency in continuous printing, suitable for 0.3mm and finer pitch mounting.
Good thixotropy, resistant to slumping during and after printing, reducing the occurrence of solder bridging/shorts.
Good wetting performance, suitable for various reflow methods, resulting in full, good solder joints with high strength and excellent conductivity.

G623 Leaded Solder Paste

G623 is a leaded solder paste developed by our company for high-precision SMT process requirements. Formulated with low-oxide Sn62Pb36Ag2 (Type 3 powder, melting point 179°C) alloy solder powder and RAM classified flux. The system incorporates high-performance thixotropic agents, providing superior wettability and continuous printability, suitable for fine-pitch components (QFP, etc.).

Features:

No-clean type, minimal residue after reflow soldering, low corrosivity, high surface insulation resistance.
Low volatile solvent system, wide operating window, good consistency in continuous printing, suitable for 0.3mm and finer pitch mounting.
Good thixotropy, resistant to slumping during and after printing, reducing the occurrence of solder bridging/shorts.
Good wetting performance, suitable for various reflow methods, resulting in full, good solder joints with high strength and excellent conductivity.

G603 Leaded Solder Paste

G603 is a leaded solder paste developed by our company for high-precision SMT process requirements. Formulated with low-oxide Sn60Pb40 (Type 3 powder, melting point 183-195°C) alloy solder powder and ROM0 classified flux. The system incorporates high-performance thixotropic agents, providing superior wettability and continuous printability, suitable for fine-pitch components (QFP, etc.).

Features:

No-clean type, minimal residue after reflow soldering, low corrosivity, high surface insulation resistance.
Low volatile solvent system, wide operating window, good consistency in continuous printing, suitable for 0.3mm and finer pitch mounting.
Good thixotropy, resistant to slumping during and after printing, reducing the occurrence of solder bridging/shorts.
Good wetting performance, suitable for various reflow methods, resulting in full, good solder joints with high strength and excellent conductivity.

G64 Leaded Solder Paste

G64 is a leaded solder paste developed by our company for high-precision SMT process requirements. Formulated with low-oxide Sn63Pb37 (Type 4 powder, melting point 183°C) alloy solder powder and RAM classified flux. The system incorporates high-performance thixotropic agents, providing superior wettability and continuous printability, suitable for fine-pitch components (QFP, etc.).

Features:

No-clean type, minimal residue after reflow soldering, low corrosivity, high surface insulation resistance.
Low volatile solvent system, wide operating window, good consistency in continuous printing, suitable for 0.3mm and finer pitch mounting.
Good thixotropy, resistant to slumping during and after printing, reducing the occurrence of solder bridging/shorts.
Good wetting performance, suitable for various reflow methods, resulting in full, good solder joints with high strength and excellent conductivity.

G63 Leaded Solder Paste

G63 is a leaded solder paste developed by our company for high-precision SMT process requirements. Formulated with low-oxide Sn63Pb37 (Type 3 powder, melting point 183°C) alloy solder powder and ROM0 classified flux. The system incorporates high-performance thixotropic agents, providing superior wettability and continuous printability, suitable for fine-pitch components (QFP, etc.).

Features:

No-clean type, minimal residue after reflow soldering, low corrosivity, high surface insulation resistance.
Low volatile solvent system, wide operating window, good consistency in continuous printing, suitable for 0.3mm and finer pitch mounting.
Good thixotropy, resistant to slumping during and after printing, reducing the occurrence of solder bridging/shorts.
Good wetting performance, suitable for various reflow methods, resulting in full, good solder joints with high strength and excellent conductivity.

G53 Leaded Solder Paste

G53 is a leaded solder paste developed by our company for high-precision SMT process requirements. Formulated with low-oxide Sn5Pb45 (Note: Original alloy composition incorrect) alloy solder powder and RAM classified flux. The system incorporates high-performance thixotropic agents, providing superior wettability and continuous printability, suitable for fine-pitch components (QFP).

Features:

No-clean, minimal residue after reflow soldering, low corrosivity, high surface insulation resistance.
Low volatile solvent system, wide operating window, good consistency in continuous printing, suitable for 0.3mm and finer pitch mounting.
Good thixotropy, resistant to slumping during and after printing, reducing the occurrence of solder bridging.
Good wetting performance, suitable for various reflow soldering methods, resulting in full, good solder joints with high strength and excellent conductivity.

B314 Low-Temperature Solder Paste

B314 is a low-temperature, water-washable solder paste developed by our company for high-precision SMT processes. Formulated with low melting point Sn43Pb43Bi14 solder powder and low-temperature flux paste. Suitable for medium-low temperature soldering processes or secondary reflow for PCBs and electronic components.

Features:

This product is an environmentally friendly solder paste with minimal residue, requiring no cleaning after soldering. ()
Good printing rollability and solder deposition, capable of fine printing on pads with pitches as low as 0.3mm.
Minimal viscosity change during continuous printing, long stencil life, maintaining good printing performance for over 8 hours.
Adaptable to various levels of soldering equipment, capable of soldering without a nitrogen atmosphere, and exhibits good soldering performance even within a narrow reflow oven temperature range.

Product model	halogen	pink path	alloy	viscosity	Surface insulation resistance (Ω)	BGA hole	Solder bead life (H)	Storage temperature (℃)	Storage time (months)	Product application
B314	ROLE0	T3	Sn43Pb43Bi14	Printing: 150-180Pa.s	>10⁸	conform to	12	0-10	6	LED lighting, LED visible light sources (instruments, screens, TVs, electrical appliances, etc.), industrial instrumentation equipment, etc.
G53	RAM	T3	Sn55Pb45	Printing: 150-180Pa.s	>10⁹	conform to	12	0-10	6
G63/G64	RAM	T3/T4	Sn63Pb37	Printing: 150-180Pa.s	>10⁹	conform to	12	0-10	6
G603	ROM0	T3	Sn60Pb40	Printing: 150-180Pa.s	>10⁹	conform to	12	0-10	6	Consumer electronics (Bluetooth modules, Bluetooth headsets, Bluetooth speakers, smart homes), network terminal equipment, automotive electronics, driving recorders, mobile phones, digital equipment, thermostats, medical, military, etc.
G623/G624	RAM	T3/T4	Sn62Pb36Ag2	Printing: 150-180Pa.s; Syringe: 100-120Pa.s	>10⁹	conform to	12	0-10	6
G642	RAM	T4	Sn62.5Pb36.5Ag1	Printing: 150-180Pa.s	>10⁹	conform to	12	0-10	6
G644	RAM	T4	Sn62.8Pb36.8Ag0.4	Printing: 150-180Pa.s	>10⁹	conform to	12	0-10	6

Formic Acid Series

Leaded SMT Solder Paste

G642 Leaded Solder Paste

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G624 Leaded Solder Paste

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G623 Leaded Solder Paste

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G603 Leaded Solder Paste

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G64 Leaded Solder Paste

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G63 Leaded Solder Paste

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G53 Leaded Solder Paste

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B314 Low-Temperature Solder Paste

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