Company Overview

Established in January 2004 in Nanshan District, Shenzhen, Earlysun Technology is a national high-tech enterprise specializing in the research and development, production, and sales of innovative new materials. Its product portfolio covers electronic assembly materials, semiconductor packaging materials, Mini & Micro packaging and assembly materials, and photovoltaic materials, among others. Key products include: SMT lead-free solder paste, SMT low-temperature lead-free solder paste, and SMT high-temperature lead-free solder paste; semiconductor solder paste, sintered silver and copper pastes, and silver adhesive; LED flip-chip die attach solder paste, epoxy adhesive, filament adhesive, dam adhesive, lens adhesive, and die attach adhesive; low-temperature silver paste, low-temperature silver-coated copper paste, and low-temperature copper paste. Earlysun Technology is a leading company in China for Mini & Micro and power semiconductor packaging materials and a pioneer in the field of innovative new material applications.

The company boasts an R&D team composed of PhDs and Masters. Since its inception, it has consistently pursued independent innovation. Its die attach solder paste was a domestic first, earning the National Excellent Patent Invention Award. Furthermore, its semiconductor formic acid solder paste holds a leading position in domestic technology and has been recognized by numerous IGBT and power device manufacturers. The innovative HJT silver-free base metal paste represents a technological breakthrough, supporting the future growth of the photovoltaic industry. The developed XS and X6 series Sn96.5Ag3Cu0.5 alloys meet the high-precision electronic assembly requirements for applications including mobile phones, computers, servers, networking equipment, medical devices, and automotive electronics, accelerating the domestic substitution process. Through 20 years of profound experience and continuous effort, Earlysun Technology has evolved into a leading provider of comprehensive welding and bonding material solutions across the semiconductor, electronics, photovoltaic, and optoelectronic industry chains.