ES84-2 Epoxy Conductive Silver Adhesive
ES84-2 epoxy conductive adhesive is suitable for high-yield, automated die attach equipment. This product features excellent viscosity and ultra-high thixotropy, enabling small-dose dispensing and fine-pitch printing with minimal tailing, stringing, or bridging issues. After curing, its volume resistivity is (300±100) μΩ·cm, making it an ideal die attach material for the semiconductor industry.
Features:
- Excellent dispensing and printing performance with minimal tailing or stringing phenomena.
- Formulated with a soluble resin system (or: cured residues are easily dissolved).
