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About Us

Development path

year 2004: Earlysun Technology was officially established

year 2006: Semiconductor package high lead solder paste, electronic assembly lead-free halogen-free solder paste

year 2010: Develop high-power LED solid crystal solder paste and obtain National Innovation Fund

year 2012: Development of fluorescent jelly gel, dam rubber LED integrated packaging process and material related invention patent

year 2013: National High-tech Enterprise LED Energy Saving and Emission Reduction Project Government Fund

year 2014: Successfully developed high-temperature semiconductor lead-free solder paste and successfully developed LED package adhesive

year 2015: Development of integrated circuit packaging materials, crystal solder paste obtained from Shenzhen technical research project

year 2016: Login to the new three board, the market share of solid crystal solder paste is the first. The domestic market share of filament rubber is the first.

year 2017: Development of integrated circuit packaging materials, crystal solder paste obtained from Shenzhen technical research project

year2018: Successfully developed MINI printing solid crystal solder paste,Successfully developed laser/HOTBAR machine solder paste

year2019: Automotive electronics, 5G field solder paste development

About Us: Company Overview; Development path; Company News; Enterprise honor

Product Center: Lead-free solder paste; Lead solder paste; COB glue; LED filament glue; UV glue、Epoxy adhesive、Red glue

Applications: Engineering solder and alloy; LED; PCB assembly

Service Support: Technical Support; Sample Application; Agent recruitment

Contact Us: Contact; Join Us

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