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Formic Acid Series

Earlysun offers various solder paste products for electronic assembly, suitable for different application scenarios and processes, providing users with the most appropriate packaging solutions.

Mini Encapsulation Adhesive

Product model chemical class Components Appearance Curing conditions Mixed viscosity (mPa.s/AR-GZ, 50s/25℃) Tensile strength (Mpa) Hardness (Shore A) Product application
GH1030 Silicone resin single component white 150℃ / 30min 15000-20000 4 35-40
RG/RGB packaging process
GH1032 Silicone resin single component colorless translucent 150℃ / 30min 10000-15000 4 35-40
GH1032 GH1030
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