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Formic Acid Series

Earlysun offers various solder paste products for electronic assembly, suitable for different application scenarios and processes, providing users with the most appropriate packaging solutions.

Filament Adhesive

Product model chemical class Components Appearance Curing conditions Mixed viscosity (mPa.s/25℃, 10rpm) Thixotropic index (3rpm/30rpm) Hardness (Shore A) Product application
DB-10A/B silicone two-component Agent A is translucent colloid, Agent B is transparent or yellowish liquid 80℃×1h+150℃×2h 20000-35000 (A:B = 4:1) 2.5-3.0 35-40
Packaging of high-power LED filament bulbs
WB-46A/B silicone two-component Agent A is translucent colloid, Agent B is transparent or yellowish liquid 170℃×4h 20000-25000 (A:B = 4:1) >2.0 40-45
WB-46-SA/B silicone two-component Agent A is translucent colloid, Agent B is transparent or yellowish liquid 80℃×1h+170℃×4h 20000-25000 (A:B = 4:1) >3.7 65-70
WB-47A/B silicone two-component Agent A is translucent colloid, Agent B is transparent or yellowish liquid 80℃×1h+170℃×4h 21000-26000 (A:B = 4:1) >3.0 50-55
WB-45A/B silicone two-component Agent A is translucent colloid, Agent B is transparent or yellowish liquid 80℃×1h+170℃×4h 40000-45000 (A:B = 4:1) >3.0 50-55
WB-47A/B WB-46A/B WB-45A/B
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