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COB Adhesive

The COB dam adhesive and encapsulant silicone manufactured by Earlysun are suitable for the bonding and COB encapsulation of various electronic components.

Dam Adhesive

Product model chemical class Components Appearance Curing conditions (℃/min) Viscosity (mPa.s/25℃, 10rpm) Thixotropic index (3rpm/30rpm) Hardness (Shore A) Product application
WB-20 silicone single component White paste 150/15-30 26000-32000 >3.0 58-60
LED surface light source, COB packaging, PTC inner layer mounting, mounting of various electronic components
WB-20-S silicone single component White paste 150/15-30 24000-30000 >3.0 58-63
WB-22-S silicone single component White paste 150/15-30 45000-55000 >4.0 58-60
WB-23 silicone single component White paste 150/15-30 35000-45000 >3.0 55-60
WB-50 silicone single component Transparent paste 150/30 35000-45000 >3.0 55-60
WB-70-2 silicone single component White paste 150/15-30 30000-50000 >4.0 75
WB-23 WB-22-S WB-20-S WB-20
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