Shenzhen Chenri Technology Co., Ltd.

X41 Lead-Free Solder Paste

X41 is a lead-free, no-clean solder paste developed by our company for high-precision SMT processes. Formulated with high-purity lead-free Sn98.5Ag1Cu0.5 (20-38um, melting point 217-227°C) alloy solder powder and an ROL0 classified carrier. It meets fine-pitch printing process requirements, has strong moisture retention, excellent soldering wettability on various components and pads, reliable physical solder joint connections, and chemically stable residues.

Features:

Lead-free Sn98.5Ag1Cu0.5 solder powder (lower Ag than SAC305), relatively low liquid metal surface tension, facilitating pad wetting and component lead climbing.
Low volatile solvent system, good moisture retention, wide operating window, consistent continuous printing performance.
Good slump resistance, no solder balls, no bridging defects, minimal and transparent residue.
Formulated with a composite activator system, resulting in bright solder joint surfaces, fewer solder dross, and low voiding.

Q4 Lead-Free Solder Paste

Q4 is a lead-free, no-clean solder paste developed by our company for high-precision SMT processes. Formulated with high-purity lead-free Sn99Ag0.3Cu0.7 (20-38um, melting point 217°C-227°C) alloy solder powder and an ROL0 classified carrier. It meets fine-pitch printing process requirements, has strong moisture retention, excellent soldering wettability on various components and pads, reliable physical solder joint connections, and chemically stable residues.

Features:

Lead-free Sn99Ag0.3Cu0.7 solder powder, relatively low liquid metal surface tension, facilitating pad wetting and component lead climbing.
Low volatile solvent system, good moisture retention, wide operating window, consistent continuous printing performance.
Good slump resistance, no solder balls, no bridging defects, minimal and transparent residue.
Formulated with a composite activator system, resulting in bright solder joint surfaces, fewer solder dross, and low voiding.

Q3 Lead-Free Solder Paste

Q3 is a no-clean solder paste developed by our company for high-precision SMT processes. Formulated with high-purity lead-free Sn99Ag0.3Cu0.7 (25-45um, melting point 217°C-227°C) alloy solder powder and ROL0 classified flux. It meets precision printing process requirements, has strong moisture retention, excellent soldering wettability on various components and pads, reliable solder joint performance, and chemically stable residues.

Features:

Lead-free Sn99Ag0.3Cu0.7 solder powder, relatively low liquid metal surface tension, facilitating pad wetting and component lead wetting.
Low volatile solvent system, good moisture retention, wide operating window, consistent continuous printing performance.
Good slump resistance, no solder balls, no bridging defects, minimal and transparent residue.
Formulated with a composite activator system, resulting in bright solder joint surfaces, fewer solder beads, and low voiding.

X5 Lead-Free Solder Paste

X5 is a lead-free, no-clean solder paste developed by our company for high-precision SMT processes. Formulated with high-purity lead-free Sn96.5Ag3Cu0.5 (15-25um, melting point 217°C) alloy solder powder and an ROL0 classified carrier. It meets fine-pitch printing process requirements, has strong moisture retention, excellent soldering wettability on various components and pads, reliable physical solder joint connections, and chemically stable residues.

Features:

Lead-free Sn96.5Ag3Cu0.5 high-silver solder powder, relatively low liquid metal surface tension, facilitating pad wetting and component lead climbing.
Low volatile solvent system, good moisture retention, wide operating window, consistent continuous printing performance.
Good slump resistance, no solder balls, no bridging defects, minimal and transparent residue.
Formulated with a composite activator system, resulting in bright solder joint surfaces, fewer solder dross, and low voiding.

X4 Lead-Free Solder Paste

X4 is a lead-free, no-clean solder paste developed by our company for high-precision SMT processes. Formulated with high-purity lead-free Sn96.5Ag3Cu0.5 (20-38um, melting point 217°C) alloy solder powder and an ROL0 classified carrier. It meets fine-pitch printing process requirements, has strong moisture retention, excellent soldering wettability on various components and pads, reliable physical solder joint connections, and chemically stable residues.

Features:

Lead-free Sn96.5Ag3Cu0.5 high-silver solder powder, relatively low liquid metal surface tension, facilitating pad wetting and component lead climbing.
Low volatile solvent system, good moisture retention, wide operating window, consistent continuous printing performance.
Good slump resistance, no solder balls, no bridging defects, minimal and transparent residue.
Formulated with a composite activator system, resulting in bright solder joint surfaces, fewer solder dross, and low voiding.

Product model	halogen	pink path	alloy	viscosity	Surface insulation resistance (Ω)	BGA hole	Solder bead life (H)	Storage temperature (℃)	Storage time (months)	Product application
X4/X5/X6	ROLE0	T4/T5/T6	Sn96.5Ag3Cu0.5	Printing: 150-220Pa.s	>10⁸	conform to	12	0-10	6	LED lighting, IGBT, consumer electronics, communication electronics, computing electronics, instrumentation, detection adapters, military electronics, new energy, industrial electronics, medical equipment, rail transit, vehicle navigation, etc.
Q3/Q4/Q5	ROLE0	T3/T4/T5	Sn96.5Ag3.3Cu0.7	Printing: 150-220Pa.s	>10⁸	conform to	12	0-10	6
X4L/X51	ROLE0	T3/T4/T5	Sn96.5Ag3Cu0.5	Printing: 150-220Pa.s	>10⁸	conform to	12	0-10	6

Formic Acid Series

Lead-free SMT Solder Paste

X41 Lead-Free Solder Paste

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Q4 Lead-Free Solder Paste

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Q3 Lead-Free Solder Paste

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X5 Lead-Free Solder Paste

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X4 Lead-Free Solder Paste

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