Shenzhen Chenri Technology Co., Ltd.

EM-6910 Mini LED Die Attach Solder Paste

EM-6910 is a die attach solder paste developed by our company for Mini LED manufacturing processes. It is formulated with high-purity lead-free Sn96Sb10 alloy (Type 6 powder, melting point 240-250°C) solder powder and an ROLO grade flux vehicle. It exhibits good printability and release properties under fine-pitch and narrow-pad conditions. After reflow soldering, residues are minimal, with no solder wicking. Solder joints are full and bright, without tin whiskers or bridging, meeting high-precision and high-reliability parameter requirements.

Features:

Excellent anti-oxidation formulation design provides a stable operational window exceeding 8 hours.
Good printability and release properties; uniform paste deposition, without tailing, stringing, or bridging phenomena, ensuring good consistency.
After reflow soldering, solder joints are full and bright with minimal voiding and no solder balling. Chips are less prone to tilting or shifting, resulting in good mounting effects.

EM-7001 Mini LED Printing Die Attach Solder Paste

EM-7001 is a die attach solder paste developed by our company for Mini LED printing processes. It is formulated with high-purity lead-free Sn96.5Ag3Cu0.5 alloy (Type 7 powder, particle size 2-11µm) solder powder and an ROLO grade flux vehicle. It exhibits good printability and release properties under fine-pitch and narrow-pad conditions, meeting high-precision and high-reliability parameter requirements.

Features:

Solder powder particle size concentrated between 2-11µm, facilitating precise control of solder paste deposition on substrate pads, meeting the die attach soldering needs for small chips such as 1mil, 4mil, 5mil, etc.
Excellent slump resistance design allows the paste to remain stable without deformation for 12 hours on the work platform. It is recommended to add new paste and mix evenly every 6 hours during printing.
Good printability and release properties; uniform paste deposition during stencil printing, without tailing, stringing, or bridging phenomena, ensuring good consistency.
After reflow soldering, solder joints are full and bright with minimal voiding and no solder balling. Chips are less prone to tilting or shifting, resulting in good mounting effects.

EM-6001 Mini LED Printing Die Attach Solder Paste

EM-6001 is a die attach solder paste developed by our company for Mini LED printing processes. It is formulated with high-purity lead-free Sn96.5Ag3Cu0.5 alloy (Type 6 powder) solder powder and an ROLO grade flux vehicle. It exhibits good printability and release properties under fine-pitch and narrow-pad conditions. After reflow soldering, residues are minimal, with no solder wicking. Solder joints are full and bright, without tin whiskers or bridging shorts, meeting high-precision and high-reliability parameter requirements.

Features:

Solder powder particle size concentrated between 3-15µm, facilitating precise control of solder paste deposition on pads, meeting the die attach soldering needs for small chips such as 3mil, 4mil, etc.
Excellent slump resistance design allows the paste to remain stable without deformation for 12 hours on the work platform. It is recommended to add new paste and mix evenly every 6 hours during printing.
Good printability and release properties; uniform paste deposition during stencil printing, without tailing, stringing, or bridging phenomena, ensuring good consistency.
After reflow soldering, solder joints are full and bright with minimal voiding and no solder balling. Chips are less prone to tilting or shifting, resulting in good mounting effects.

EM-9351-6 Low-Temperature Lead-Free Solder Paste

EM-9351-6 low-temperature lead-free solder paste is a no-clean solder paste developed by our company suitable for Mini LED applications. It is formulated with a tin-bismuth-silver based low-melting-point lead-free alloy solder powder (Sn64Bi35Ag1, Type 6 powder) and a low-temperature flux vehicle. This product is suitable for processes requiring lower soldering temperatures or for secondary reflow processes, effectively protecting PCBs and electronic components that cannot withstand high temperatures.

Features:

This is an environmentally friendly solder paste with minimal residue, requiring no cleaning after soldering.
Good printing roll and paste release properties, enabling fine printing even for 0.5mm pitch pads; stable viscosity for syringe dispensing or roller coating.
Minimal viscosity change during continuous printing; long stencil life (remains effective for over 8 hours without drying out, maintaining good printing results).
Adaptable to various levels of soldering equipment requirements, exhibiting good soldering performance over a wide reflow temperature range.

Product model	halogen	pink path	alloy	viscosity	Surface insulation resistance (Ω)	BGA hole	Solder bead life (H)	Storage temperature (℃)	Storage time (months)	Product application
EM-9351-6	ROLE0	T6	Sn96.5Ag3Cu0.5	Dispensing: 50±10 Pa.s	>10⁸	conform to	12	0-10	6	LED packaging form (Weike application), flip chip, COB, COG, MIP, etc.
EM-6001/7001	ROLE0	T6/T7	Sn96.5Ag3Cu0.5	Printing: 100±20Pa.s	>10⁸	conform to	12	0-10	6
EM-6910	ROLE0	T6	Sn95Sb10	Dispensing: 80-120Pa.s	>10⁸	conform to	12	0-10	6

Formic Acid Series

MiniLED Die Attach Solder Past

EM-6910 Mini LED Die Attach Solder Paste

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EM-7001 Mini LED Printing Die Attach Solder Paste

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EM-6001 Mini LED Printing Die Attach Solder Paste

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EM-9351-6 Low-Temperature Lead-Free Solder Paste

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