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Other Adhesives

Earlysun provides various silicone and epoxy adhesives to meet the potting and bonding needs of electronic components.

Mini Encapsulation Adhesive

Product model chemical class Components Appearance Curing conditions Mixed viscosity (mPa.s/AR-GZ, 50s/25℃) Tensile strength (Mpa) Hardness (Shore A) Product application
GH1030 Silicone resin single component white 150℃ / 30min 15000-20000 4 35-40
RG/RGB packaging process
GH1032 Silicone resin single component colorless translucent 150℃ / 30min 10000-15000 4 35-40
GH1032 GH1030
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