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COB Adhesive

The COB dam adhesive and encapsulant silicone manufactured by Earlysun are suitable for the bonding and COB encapsulation of various electronic components.

UV Adhesive

Product model chemical class Components Appearance Viscosity (mPa.s) Shear strength (Mpa) Tensile strength (Mpa) Hardness (Shore D) Product application
UV801 UV glue single component colorless transparent liquid 25000-35000 >10 >12 25-35 Circuit protection, chip protection, glass metal, ceramic plastic bonding, can also be used for potting protection of LCD glass.
uv801
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