ED-3040 LED Die Attach Adhesive
This product should be allowed to warm up to room temperature before use. Using it directly without warming may cause moisture absorption and lead to bubble formation during curing.
If there is doubt about whether a certain material might inhibit curing, it is recommended to conduct a compatibility test first to assess its suitability. If uncured adhesive is present at the interface between the test material and the cured die attach adhesive, it indicates inhibition (incompatibility); if fully cured, it indicates compatibility.
Certain substances can inhibit the curing of die attach adhesive, primarily including:
- Organotin and other organometallic compounds.
- Sulfur, polysulfides, polysulfones, or other sulfur-containing substances.
- Amines, polyamides, or other nitrogen-containing substances.
- Phosphites or other phosphorus-containing substances.
- Certain flux residues.
