ES-510-SP Series High-Lead Solder Paste
ES-510-SP is a high-lead solder paste series produced by our company for power semiconductor package soldering, using 10% Sn content, meeting customer requirements for precision printing processes. It can be used for packaging and soldering products such as power tubes, diodes, triodes, rectifier bridges, and small integrated circuits.
Features:
- Specifically designed for power semiconductor package soldering, wide operating window, exempt solder under the RoHS directive.
- Good consistency during long-duration printing, excellent release properties, suitable for mounting micro-grain size chips.
- Good solderability, high online yield, solder joint void rate below 10%.
- High insulation resistance of residues, suitable for no-clean processes; residues are easily soluble in organic solvents.
- Full, bright, high-strength solder joints with excellent electrical performance after soldering.
- Applicable heating methods: Reflow oven, tunnel furnace, constant temperature oven, etc.
