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COB Adhesive

The COB dam adhesive and encapsulant silicone manufactured by Earlysun are suitable for the bonding and COB encapsulation of various electronic components.

Filament Adhesive

Product model chemical class Components Appearance Curing conditions Mixed viscosity (mPa.s/25℃, 10rpm) Thixotropic index (3rpm/30rpm) Hardness (Shore A) Product application
DB-10A/B silicone two-component Agent A is translucent colloid, Agent B is transparent or yellowish liquid 80℃×1h+150℃×2h 20000-35000 (A:B = 4:1) 2.5-3.0 35-40
Packaging of high-power LED filament bulbs
WB-46A/B silicone two-component Agent A is translucent colloid, Agent B is transparent or yellowish liquid 170℃×4h 20000-25000 (A:B = 4:1) >2.0 40-45
WB-46-SA/B silicone two-component Agent A is translucent colloid, Agent B is transparent or yellowish liquid 80℃×1h+170℃×4h 20000-25000 (A:B = 4:1) >3.7 65-70
WB-47A/B silicone two-component Agent A is translucent colloid, Agent B is transparent or yellowish liquid 80℃×1h+170℃×4h 21000-26000 (A:B = 4:1) >3.0 50-55
WB-45A/B silicone two-component Agent A is translucent colloid, Agent B is transparent or yellowish liquid 80℃×1h+170℃×4h 40000-45000 (A:B = 4:1) >3.0 50-55
WB-47A/B WB-46A/B WB-45A/B
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