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Leaded Series

Earlysun offers various solder paste products for electronic assembly, suitable for different application scenarios and processes, providing users with the most appropriate packaging solutions.

Dam Adhesive

Product model chemical class Components Appearance Curing conditions (℃/min) Viscosity (mPa.s/25℃, 10rpm) Thixotropic index (3rpm/30rpm) Hardness (Shore A) Product application
WB-20 silicone single component White paste 150/15-30 26000-32000 >3.0 58-60
LED surface light source, COB packaging, PTC inner layer mounting, mounting of various electronic components
WB-20-S silicone single component White paste 150/15-30 24000-30000 >3.0 58-63
WB-22-S silicone single component White paste 150/15-30 45000-55000 >4.0 58-60
WB-23 silicone single component White paste 150/15-30 35000-45000 >3.0 55-60
WB-50 silicone single component Transparent paste 150/30 35000-45000 >3.0 55-60
WB-70-2 silicone single component White paste 150/15-30 30000-50000 >4.0 75
WB-23 WB-22-S WB-20-S WB-20
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