Shenzhen Chenri Technology Co., Ltd.

MS-D6 Lead-Free Solder Paste

MS-D6 is a lead-free, no-clean solder paste developed by our company suitable for soldering MEMS systems and devices. It is formulated with high-purity Sn96Sb10 alloy (Type 6 powder, melting point 240-250°C) solder powder and an ROLO grade flux vehicle. Applicable processes include dispensing and printing. It exhibits good soldering activity on various components and pads, resulting in reliable physical connections of solder joints and offering wide applicability.

Features:

Uses lead-free Sn96Sb10 solder powder, suitable for higher temperature soldering and secondary reflow processes.
Good solderability on various components, excellent wettability, and low BGA voiding rate.
Good resistance to thermal slump, no solder balling or bridging defects; minimal, transparent residues, no-clean.
Excellent printing performance, good solder joint formation after reflow.

MS-D5 Lead-Free Solder Paste

MS-D5 is a lead-free, no-clean solder paste developed by our company suitable for soldering MEMS systems and devices. It is formulated with high-purity Sn96Sb10 alloy (Type 5 powder, melting point 240-250°C) solder powder and an ROLO grade flux vehicle. Applicable processes include dispensing and printing. It exhibits good soldering activity on various components and pads, resulting in reliable physical connections of solder joints and offering wide applicability.

Features:

Uses lead-free Sn96Sb10 solder powder, suitable for higher temperature soldering and secondary reflow processes.
Good solderability on various components, excellent wettability, and low BGA voiding rate.
Good resistance to thermal slump, no solder balling or bridging defects; minimal, transparent residues, no-clean.
Excellent printing performance, good solder joint formation after reflow.

MS-S6 Lead-Free Solder Paste

MS-S6 is a lead-free, no-clean solder paste developed by our company suitable for soldering MEMS systems and devices. It is formulated with high-purity Sn96.5Ag3Cu0.5 (Type 6 powder, melting point 217°C) alloy solder powder and an ROLO grade flux vehicle. Applicable processes include dispensing and printing. It exhibits good soldering activity on various components and pads, resulting in reliable physical connections of solder joints and offering wide applicability.

Features:

Uses lead-free Sn96.5Ag3Cu0.5 alloy solder powder, suitable for precision components with high soldering requirements, especially suitable for dispensing applications.
Good solderability on various components, excellent wettability, and low BGA voiding rate.
Good resistance to thermal slump, no solder balling or bridging defects; minimal, transparent residues, no-clean.
Excellent printing results achievable with continuous printing.

MS-S5 Lead-Free Solder Paste

MS-S5 is a lead-free, no-clean solder paste developed by our company suitable for soldering MEMS systems and devices. It is formulated with high-purity Sn96.5Ag3Cu0.5 (Type 5 powder, melting point 217°C) alloy solder powder and an ROLO grade flux vehicle. Applicable processes include dispensing and printing. It exhibits good soldering activity on various components and pads, resulting in reliable physical connections of solder joints and offering wide applicability.

Features:

Uses lead-free Sn96.5Ag3Cu0.5 alloy solder powder, suitable for precision components with high soldering requirements, especially suitable for dispensing applications.
Good solderability on various components, excellent wettability, and low BGA voiding rate.
Good resistance to thermal slump, no solder balling or bridging defects; minimal, transparent residues, no-clean.
Excellent printing results achievable with continuous printing.

Product model	halogen	pink path	alloy	viscosity	Surface insulation resistance (Ω)	BGA hole	Solder bead life (H)	Storage temperature (℃)	Storage time (months)	Product application
MS-S3/S6	ROLE0	T5/T6	Sn96.5Ag3.0Cu0.5	Printing: 150±20Pa.s; Dispensing: 100±20Pa.s	>10⁸	conform to	12	0-10	6	Microelectronics technology, integrated circuit packaging technology and processing technology, aviation industry, shipbuilding and ships, space and launch vehicles, hydrogen, wind power, organic synthesis, biochemistry and consumer electronics
MS-D5/D6	ROLE0	T5/T6	Sn89Sb10	Printing: 150±20Pa.s; Dispensing: 70±10Pa.s	>10⁸	conform to	12	0-10	6

Leaded Series

MEMS Soldering Lead-freeSolder

MS-D6 Lead-Free Solder Paste

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MS-D5 Lead-Free Solder Paste

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MS-S6 Lead-Free Solder Paste

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MS-S5 Lead-Free Solder Paste

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