Shenzhen Chenri Technology Co., Ltd.

JS-668 High-Lead Formic Acid Solder Paste

JS-668 is a high-reliability, high-lead solder paste produced by our company for packaging and soldering power devices such as IGBTs and MOSFETs. Reflowed in reducing or inert atmospheres, it leaves extremely low residue, meeting the ultra-low void soldering requirements for IGBTs and automotive-grade power devices. The product is suitable for automated dispensing and printing processes.

Features:

Residue-free, can replace solder preforms, no cleaning required.
Good solderability, high online yield, and ultra-low solder joint void rate.
High metal content, resulting in full, bright, high-strength solder joints with excellent electrical performance after reflow.
Applicable heating method: Formic acid vacuum furnace.
Uses Sn5Pb92.5Ag2.5 solder powder, exempt solder under the RoHS directive.

JS-880 Lead-Free Formic Acid Solder Paste

JS-880 is a high-reliability lead-free formic acid solder paste developed by our company. Uses high-purity lead-free Sn96.5Ag3Cu0.5 (Type 4 / 5 / 6 powder, melting point 217°C) alloy solder powder. Reflowed in a formic acid reducing atmosphere, it meets the ultra-low void soldering requirements for IGBTs and automotive-grade power devices. It can completely replace existing cleaning-type solder paste and solder preform processes, achieving no-clean savings and significantly reducing costs for customers in terms of environmental impact, process steps, and materials. The product is suitable for automated dispensing and printing processes.

Features:

Lead-free Sn96.5Ag3Cu0.5 high-silver solder powder, relatively low liquid metal surface tension.
Minimal residue, can replace solder preforms, no cleaning required.
Good solderability, high online yield, and ultra-low solder joint void rate.
Stable chemical properties, good product flowability, meets requirements for long-duration dispensing and printing, minimal viscosity change.
Applicable heating method: Formic acid vacuum furnace.

JS-990 Lead-Free High-Temperature Formic Acid Solder Paste

JS-990 is a high-reliability, lead-free formic acid solder paste developed by our company. Uses high-purity tin-antimony Sn90Sb10 alloy (Type 4 / 5 powder, melting point 235-255°C) solder powder. Reflowed in a formic acid reducing atmosphere, it meets the ultra-low void soldering requirements for IGBTs and automotive-grade power devices. It can completely replace existing cleaning-type solder paste and solder preform processes, achieving no-clean savings and significantly reducing costs for customers in terms of environmental impact, process steps, and materials. The product is suitable for automated dispensing and printing processes.

Features:

Lead-free Sn90Sb10 solder powder has a higher melting point than common Sn96.5Ag3Cu0.5 alloy, meeting customer process requirements for higher melting points.
Zero residue, can replace solder preforms, no cleaning required.
Good solderability, high online yield, and ultra-low solder joint void rate.
Good automated dispensing stability, minimal viscosity change, consistent dispensing volume.
Good rheology, stable chemical properties, meeting requirements for long-duration dispensing processes, significantly improving production efficiency.
Applicable heating method: Formic acid vacuum furnace.

JS-950-M Lead-Free High-Temperature No-Clean Solder Paste

JS-950-M is a high-reliability, lead-free, high-temperature, no-clean solder paste developed by our company. Uses high-purity lead-free Sn95Sb5 alloy (Type 4 / 5 powder, melting point 235-245°C) solder powder. Reflowed in reducing/inert atmospheres, it meets the ultra-low void soldering requirements for IGBTs and automotive-grade power devices. Extremely low residue allows customers to potentially meet no-clean requirements to some extent, offering high reliability and significantly reducing costs for customers in terms of environmental impact, process steps, and materials. The product is suitable for automated dispensing and printing processes.

Features:

Lead-free Sn95Sb5 solder powder has a higher melting point than common Sn96.5Ag3Cu0.5 alloy, meeting customer process requirements for higher melting points.
Extremely low residue, can potentially meet process requirements for no-clean to some extent.
Good solderability, high online yield, and extremely low solder joint void rate.
Stable chemical properties, good product flowability, meets requirements for long-duration dispensing and printing operations, minimal viscosity change.
Applicable heating methods: Formic acid vacuum furnace, vacuum reflow soldering, vacuum eutectic furnace.

Product model	halogen	pink path	alloy	viscosity	Surface insulation resistance (Ω)	BGA hole	Solder bead life (H)	Storage temperature (℃)	Storage time (months)	Product application
JS-950	L0	T4/T5	Sn95Sb5	Dispensing: 40±5 Pa.s; Printing: 150±50 Pa.s	>10⁸	conform to	12	0-10	6	IGBT, semiconductor packaging, aerospace, medical, military and other industries with high requirements on post-welding residues
JS-990	L0	T4/T5	Sn99Ag0.3Cu0.7	Dispensing: 50±5 Pa.s; Printing: 150±50 Pa.s	>10⁸	conform to	12	0-10	6
JS-980	L0	T4	Sn99Ag0.3Cu0.5	Dispensing: 50±5 Pa.s; Printing: 150±50 Pa.s	>10⁸	conform to	12	0-10	6
JS-668	L0	T4	Sn5Pb92.5Ag2.5	Dispensing: 50±5 Pa.s; Printing: 150±50 Pa.s	>10⁸	conform to	12	0-10	6