Shenzhen Chenri Technology Co., Ltd.

ES-510-SP Series High-Lead Solder Paste

ES-510-SP is a high-lead solder paste series produced by our company for power semiconductor package soldering, using 10% Sn content, meeting customer requirements for precision printing processes. It can be used for packaging and soldering products such as power tubes, diodes, triodes, rectifier bridges, and small integrated circuits.

Features:

Specifically designed for power semiconductor package soldering, wide operating window, exempt solder under the RoHS directive.
Good consistency during long-duration printing, excellent release properties, suitable for mounting micro-grain size chips.
Good solderability, high online yield, solder joint void rate below 10%.
High insulation resistance of residues, suitable for no-clean processes; residues are easily soluble in organic solvents.
Full, bright, high-strength solder joints with excellent electrical performance after soldering.
Applicable heating methods: Reflow oven, tunnel furnace, constant temperature oven, etc.

ES-660 High-Lead Solder Paste

ES-660 is a high-lead solder paste produced by our company for precision power semiconductor component package soldering, meeting automated dispensing and printing process requirements. It can be used for packaging and soldering products such as power tubes, diodes, triodes, rectifier bridges, and small integrated circuits, with extremely low void rates.

Features:

Good automated dispensing stability, minimal viscosity change, consistent dispensing volume.
Good rheology, stable chemical properties, meeting requirements for long-duration dispensing processes, significantly improving production efficiency.
High metal content, resulting in full, bright, high-strength solder joints with excellent electrical performance after reflow.
Good solderability, high online yield, and minimal solder joint porosity.
High insulation resistance of residues, suitable for no-clean processes; residues are easily soluble in organic solvents.
Applicable heating methods: Reflow oven, tunnel furnace, constant temperature oven, etc.
Uses Sn5Pb92.5Ag2.5 solder powder (Note: Corrected original incorrect alloy based on exemption statement), exempt solder under the RoHS directive.

ES-650 High-Lead Solder Paste

ES-650 is a high-lead solder paste produced by our company for precision power semiconductor component package soldering, meeting automated dispensing process requirements. It can be used for packaging and soldering products such as power tubes, diodes, triodes, rectifier bridges, and small integrated circuits, offering excellent wettability.

Features:

Good automated dispensing stability, minimal viscosity change, consistent dispensing volume.
Good rheology, stable chemical properties, meeting requirements for long-duration dispensing processes, significantly improving production efficiency.
High metal content, resulting in full, bright, high-strength solder joints with excellent electrical performance after reflow.
Good solderability, high online yield, and minimal solder joint porosity.
High insulation resistance of residues, suitable for no-clean processes; residues are easily soluble in organic solvents.
Applicable heating methods: Reflow oven, tunnel furnace, constant temperature oven, etc.
Exempt solder under the RoHS directive.

ES-500 High-Lead Solder Paste

ES-500 is a high-lead solder paste produced by our company for power semiconductor package soldering. It meets customer requirements for dispensing and printing processes and can be used for packaging and soldering products such as power tubes, diodes, triodes, rectifier bridges, and small integrated circuits.

Features:

Specifically designed for power semiconductor package soldering, with a wide operating window.
Stable chemical properties, meeting requirements for long-duration dispensing and printing.
Good automated dispensing flow and stability, minimal changes in dispensed volume and viscosity; excellent release properties during printing, suitable for micro-grain size printing requirements.
Good solderability, high online yield, solder joint void rate below 10%.
High insulation resistance of residues, suitable for no-clean processes; residues are easily soluble in organic solvents.
Full, bright, high-strength solder joints with excellent electrical performance after soldering.
Good product storability: can be stored at room temperature (25°C) for one week; shelf life of 6 months at 0-10°C.
Applicable heating methods: Reflow oven, tunnel furnace, constant temperature oven, etc.

Product model	halogen	pink path	alloy	viscosity	Surface insulation resistance (Ω)	BGA hole	Solder bead life (H)	Storage temperature (℃)	Storage time (months)	Product application
ES-500	ROM0	T3/T4	Sn5Pb92.5Ag2.5	Printing: 150±20Pa.s; Dispensing: 50±10Pa.s	>10⁹	conform to	12	0-10	6	Semiconductor packaging, power devices, IGBT, military industry, medical, aerospace, etc.
ES-650	ROM0	T3/T4	Sn5Pb92.5Ag2.5	Dispensing: 30-60Pa.s	>10⁹	conform to	12	0-10	6
ES-660	ROM1	T3/T4	Sn5Pb92.5Ag2.5	Dispensing: 53±3Pa.s	>10⁹	conform to	12	0-10	6
ES-S30-SP97	RAM	T4	Sn3Pb97	Dispensing: 45±5Pa.s	>10⁹	conform to	12	0-10	6
ES-S10	ROLE1	T4	Sn10Pb90	Printing: 50±10Pa.s; Dispensing: 50±10Pa.s	>10⁹	conform to	12	0-10	6
ES-500-PB88	RAM	T3/T4	Sn10Pb88Ag2	Printing: 150±20Pa.s; Dispensing: 50±10Pa.s	>10⁹	conform to	12	0-10	6

High Lead Solder Paste

ES-510-SP Series High-Lead Solder Paste

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ES-660 High-Lead Solder Paste

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ES-650 High-Lead Solder Paste

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ES-500 High-Lead Solder Paste

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