ES-W800 Series Water-Washable Solder Paste
The ES-W800 series is a water-washable lead-free solder paste developed by our company. Formulated with high-purity lead-free alloy solder powder and a water-washable flux paste carrier, it is suitable for soldering applications such as IGBTs, thick-film circuits, SiP packaging, and high-precision circuit boards. It provides good soldering wettability on various components and pads, reliable physical solder joint connections, and meets requirements for extremely low void rates and high reliability.
Features:
- Based on customer soldering alloy requirements, the ES-W800 series can offer various lead-free alloy combinations, such as Sn96.5Ag3Cu0.5, Sn96.5Ag3.5, Sn99Ag0.3Cu0.7, Sn99.3Cu0.7, etc. The representative alloy is Sn96.5Ag3Cu0.5; this alloy has relatively low liquid metal surface tension, facilitating pad wetting and component lead climbing. All the above alloys can be provided in Type 3-6 powder sizes, with Type 4 powder (20-38μm) being typical.
- Low volatile system, good moisture retention, wide operating window, consistent continuous printing performance.
- Residues after reflow soldering are completely soluble in water, leaving no residue after cleaning, minimal corrosion to components.
- Formulated with a composite activator system, resulting in bright solder joint surfaces, fewer solder balls, and extremely low voiding.
