Shenzhen Chenri Technology Co., Ltd.

B58 Low-Temperature Lead-Free Solder Paste

B58 is a low-temperature, lead-free, no-clean solder paste developed by our company for high-precision SMT processes. It is formulated with low melting point lead-free alloy solder powder (Sn42Bi58, Type 5 powder, melting point 138°C) and low-temperature flux paste. Suitable for medium-low temperature soldering processes or secondary reflow processes, effectively protecting PCBs and electronic components that cannot withstand high temperatures.

Features:

This product is a zero-halogen solder paste with minimal residue, requiring no cleaning after soldering.
Good printing rollability and solder deposition, capable of fine printing on pads with pitches as low as 0.3mm.
Minimal viscosity change during continuous printing, long stencil life (solder paste), maintaining good printing performance for over 8 hours.
Adaptable to various levels of soldering equipment, capable of soldering without a nitrogen atmosphere, and exhibits good soldering performance even within a narrow reflow oven temperature range.

B48 Low-Temperature Lead-Free Solder Paste

B48 is a low-temperature, lead-free, no-clean solder paste developed by our company for high-precision SMT processes. It is formulated with low melting point lead-free alloy solder powder (Sn42Bi58, Type 4 powder, melting point 138°C) and low-temperature flux paste. Suitable for medium-low temperature soldering processes or secondary reflow processes, effectively protecting PCBs and electronic components that cannot withstand high temperatures.

Features:

This product is a zero-halogen solder paste with minimal residue, requiring no cleaning after soldering.
Good printing rollability and solder deposition, capable of fine printing on pads with pitches as low as 0.3mm.
Minimal viscosity change during continuous printing, long stencil life (solder paste), maintaining good printing performance for over 8 hours.
Adaptable to various levels of soldering equipment, capable of soldering without a nitrogen atmosphere, and exhibits good soldering performance even within a narrow reflow oven temperature range.

B38 Low-Temperature Lead-Free Solder Paste

B38 is a low-temperature, lead-free, no-clean solder paste developed by our company for high-precision SMT processes. It is formulated with low melting point lead-free alloy solder powder (Sn42Bi58, Type 3 powder, melting point 138°C) and low-temperature flux paste. Suitable for medium-low temperature soldering processes or secondary reflow processes, effectively protecting PCBs and electronic components that cannot withstand high temperatures.

Features:

This product is a zero-halogen solder paste with minimal residue, requiring no cleaning after soldering.
Good printing rollability and solder deposition, capable of fine printing on pads with pitches as low as 0.3mm.
Minimal viscosity change during continuous printing, long stencil life (solder paste), maintaining good printing performance for over 8 hours.
Adaptable to various levels of soldering equipment, capable of soldering without a nitrogen atmosphere, and exhibits good soldering performance even within a narrow reflow oven temperature range.

B453 Mid-Temperature Lead-Free Solder Paste

B453 is a mid-temperature, lead-free, no-clean solder paste developed by our company for high-precision SMT processes. Formulated with mid-temperature melting point lead-free alloy solder powder (Sn64.7Bi35Ag0.3, Type 4 powder, melting point 145-172°C) and mid-temperature flux paste. Suitable for medium-low temperature soldering processes or secondary reflow processes, effectively protecting PCBs and electronic components that cannot withstand high temperatures.

Features:

This product is an environmentally friendly solder paste with minimal residue, requiring no cleaning after soldering.
Good printing rollability and solder deposition, capable of fine printing on pads with pitches as low as 0.3mm.
Minimal viscosity change during continuous printing, long stencil life (solder paste), maintaining good printing performance for over 8 hours.
Adaptable to various levels of soldering equipment, capable of soldering without a nitrogen atmosphere, and exhibits good soldering performance even within a narrow reflow oven temperature range.

B353 Mid-Temperature Lead-Free Solder Paste

B353 is a mid-temperature, lead-free, no-clean solder paste developed by our company for high-precision SMT processes. Formulated with mid-temperature melting point lead-free alloy solder powder (Sn64.7Bi35Ag0.3 (Note: Original alloy format error, presumed), Type 3 powder, melting point 145-172°C) and mid-temperature flux paste. Suitable for medium-low temperature soldering processes or secondary reflow processes, effectively protecting PCBs and electronic components that cannot withstand high temperatures.

Features:

This product is an environmentally friendly solder paste with minimal residue, requiring no cleaning after soldering.
Good printing rollability and solder deposition, capable of fine printing on pads with pitches as low as 0.3mm.
Minimal viscosity change during continuous printing, long stencil life (solder paste), maintaining good printing performance for over 8 hours.
Adaptable to various levels of soldering equipment, capable of soldering without a nitrogen atmosphere, and exhibits good soldering performance even within a narrow reflow oven temperature range.

B451 Mid-Temperature Lead-Free Solder Paste

B451 is a mid-temperature, lead-free solder paste developed by our company for high-precision SMT processes. Formulated with mid-temperature melting point lead-free alloy solder powder (Sn64Bi35Ag1 (Note: Original alloy composition questionable, presumed), Type 4 powder, melting point 145-172°C) and mid-temperature flux paste. Suitable for medium temperature soldering processes or secondary reflow processes, effectively protecting PCBs and electronic components that cannot withstand high temperatures.

Features:

This product is an environmentally friendly solder paste with minimal residue, requiring no cleaning after soldering.
Good printing rollability and solder deposition, capable of fine printing on pads with pitches as low as 0.3mm.
Minimal viscosity change during continuous printing, long stencil life (solder paste), maintaining good printing performance for over 8 hours.
Adaptable to various levels of soldering equipment, capable of soldering without a nitrogen atmosphere, and exhibits good soldering performance even within a narrow reflow oven temperature range.

B351 Mid-Temperature Lead-Free Solder Paste

B351 is a mid-temperature, lead-free, no-clean solder paste developed by our company for high-precision SMT processes. Formulated with mid-temperature melting point lead-free alloy solder powder (Sn64.7Bi35Ag0.3 (Note: Original alloy format error, presumed), Type 3 powder, melting point 145-172°C) and mid-temperature flux paste. Suitable for medium-low temperature soldering processes or secondary reflow processes, effectively protecting PCBs and electronic components that cannot withstand high temperatures.

Features:

This product is an environmentally friendly solder paste with minimal residue, requiring no cleaning after soldering.
Good printing rollability and solder deposition, capable of fine printing on pads with pitches as low as 0.3mm.
Minimal viscosity change during continuous printing, long stencil life (solder paste), maintaining good printing performance for over 8 hours.
Adaptable to various levels of soldering equipment, capable of soldering without a nitrogen atmosphere, and exhibits good soldering performance even within a narrow reflow oven temperature range.

Product model	halogen	pink path	alloy	viscosity	Surface insulation resistance (Ω)	BGA hole	Solder bead life (H)	Storage temperature (℃)	Storage time (months)	Product application
B351/B451	ROLE0	T3/T4	Sn48BiAg1	Printing: 150-180Pa.s; Syringe: 100-160Pa.s	>10⁸	conform to	12	0-10	6	LED lighting fixtures, LED backlights, CPU radiators, remote controls, induction cookers, mice, keyboards, etc.
B353/B453	ROLE0	T3/T4	SnBi7Bi35Ag1	Printing: 160±20Pa.s; Dispensing: 100±20Pa.s	>10⁸	conform to	12	0-10	6
B38/B48/B58	ROLE0	T3/T4	Sn42Bi58	Printing: 160±20Pa.s; Dispensing: 100±20Pa.s	>10⁸	conform to	12	0-10	6

LED Filament Adhesive

Medium-Low Temp Solder Paste

B58 Low-Temperature Lead-Free Solder Paste

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B48 Low-Temperature Lead-Free Solder Paste

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B38 Low-Temperature Lead-Free Solder Paste

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B453 Mid-Temperature Lead-Free Solder Paste

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B353 Mid-Temperature Lead-Free Solder Paste

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B451 Mid-Temperature Lead-Free Solder Paste

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B351 Mid-Temperature Lead-Free Solder Paste

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