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Other Adhesives

Earlysun provides various silicone and epoxy adhesives to meet the potting and bonding needs of electronic components.

Dam Adhesive

Product model chemical class Components Appearance Curing conditions (℃/min) Viscosity (mPa.s/25℃, 10rpm) Thixotropic index (3rpm/30rpm) Hardness (Shore A) Product application
WB-20 silicone single component White paste 150/15-30 26000-32000 >3.0 58-60
LED surface light source, COB packaging, PTC inner layer mounting, mounting of various electronic components
WB-20-S silicone single component White paste 150/15-30 24000-30000 >3.0 58-63
WB-22-S silicone single component White paste 150/15-30 45000-55000 >4.0 58-60
WB-23 silicone single component White paste 150/15-30 35000-45000 >3.0 55-60
WB-50 silicone single component Transparent paste 150/30 35000-45000 >3.0 55-60
WB-70-2 silicone single component White paste 150/15-30 30000-50000 >4.0 75
WB-23 WB-22-S WB-20-S WB-20
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