Shenzhen Chenri Technology Co., Ltd.

ES-1200 Die Attach Solder Paste

ES-1200 die attach solder paste is formulated with high-purity lead-free Sn96.5Ag3Cu0.5 alloy (Type 5 powder) solder powder and an ROLO grade flux vehicle. Suitable for soldering face-up LED chips larger than 10mil and flip-chip LEDs longer than 15mil.

Features:

High thermal and electrical conductivity; alloy thermal conductivity is 50-72 W/(m·K).
Suitable for printing processes; good thixotropy with appropriate viscosity for printing, good dispensability.
Minimal residue; after placing the die-attached LED substrate in a 40°C constant temperature chamber for 240 hours, the residue and substrate metal show no discoloration and do not affect the LED's luminous efficacy.

ES-1100 Die Attach Solder Paste

ES-1100 die attach solder paste is formulated with high-purity lead-free Sn96Sb10 alloy (Type 6 powder) solder powder and an ROLO grade flux vehicle. Suitable for packaging high-power LED beads on all metal-coated chips, meeting the reliability requirements for secondary reflow.

Features:

High thermal and electrical conductivity, long working life.
Suitable for die attach machine or dispenser processes; good thixotropy with appropriate viscosity for die attach and dispensing, good dispensability.
Minimal residue; after placing the die-attached LED substrate in a 40°C constant temperature chamber for 240 hours, the residue and substrate metal show no discoloration and do not affect the LED's luminous efficacy.

ES-1006 Die Attach Solder Paste

ES-1006 die attach solder paste is formulated with high-purity lead-free Sn96.5Ag3Cu0.5 alloy (Type 6 powder) solder powder and an ROLO grade flux vehicle. It is suitable for soldering face-up LED chips larger than 10mil and flip-chip LEDs longer than 15mil. Widely used in flip-chip LED COB, flip-chip LED digital displays, flip-chip LED strips, flip-chip LED flexible strips, and flip-chip LED filament packaging.

Features:

High thermal and electrical conductivity; alloy thermal conductivity is 50-72 W/(m·K).
Suitable for die attach machine or dispenser processes; good thixotropy with appropriate viscosity for die attach and dispensing, good dispensability.
Minimal residue; after placing the die-attached LED substrate in a 40°C constant temperature chamber for 240 hours, the residue and substrate metal show no discoloration and do not affect the LED's luminous efficacy.
After reflow soldering, solder joints are full and bright with minimal voiding and no solder balling. Chips are less prone to tilting or shifting, resulting in good soldering effects.

ES-1000 Die Attach Solder Paste

ES-1000 die attach solder paste is formulated with high-purity lead-free Sn96.5Ag3Cu0.5 alloy (Type 6 powder) solder powder and an ROLO grade flux vehicle. It is suitable for soldering face-up LED chips larger than 10mil and flip-chip LEDs longer than 15mil. Widely used in flip-chip LED COB, flip-chip LED digital displays, flip-chip LED strips, flip-chip LED flexible strips, and flip-chip LED filament packaging.

Features:

High thermal and electrical conductivity; alloy thermal conductivity is 50-72 W/(m·K).
Suitable for die attach machine or dispenser processes; good thixotropy with appropriate viscosity for die attach and dispensing, good dispensability.
Minimal residue; after placing the die-attached LED substrate in a 40°C constant temperature chamber for 240 hours, the residue and substrate metal show no discoloration and do not affect the LED's luminous efficacy.
After reflow soldering, solder joints are full and bright with minimal voiding and no solder balling. Chips are less prone to tilting or shifting, resulting in good soldering effects.

Product model	halogen	pink path	alloy	viscosity	Surface insulation resistance (Ω)	BGA hole	Solder bead life (H)	Storage temperature (℃)	Storage time (months)	Product application
ES-1000	ROLE0	T6/T7	Sn96.5Ag3Cu0.5	Dispensing: 30±5Pa.s	>10⁸	conform to	12	0-10	6	COB lamp strip, LED flip chip welding, COB light source, CSP lamp bead, MIP, sensor, flip chip lamp bead, SPF package
ES-1006	ROLE0	T6	Sn96.5Ag3Cu0.5	Dispensing: 30±5Pa.s	>10⁸	conform to	12	0-10	6
ES-1100	ROM0	T6	Sn90Sb10	Dispensing: 30±5Pa.s	>10⁸	conform to	12	0-10	6
ES-1200	ROLE0	T5	Sn96.5Ag3Cu0.5	Printing: 80-120Pa.s	>10⁸	conform to	12	0-10	6	LED packaging form (Weike application), flip chip, COB, COG, MIP, etc.