About Us
Company Overview
Development path
Company News
Enterprise honor
Product Center
Lead-free Series
Lead-free SMT Solder Paste
Medium-Low Temp Solder Paste
Laser Hot Bar Solder Paste
MEMS Soldering Lead-freeSolder
Die Attach Solder Paste
MiniLED Die Attach Solder Past
Water Soluble Solder Paste
Leaded Series
High Lead Solder Paste
Leaded SMT Solder Paste
Formic Acid Series
Formic Acid Solder Paste
COB Adhesive
COB Encapsulation Adhesive
Dam Adhesive
LED Filament Adhesive
Filament Adhesive
Other Adhesives
Mini Encapsulation Adhesive
Die Attach Adhesive
UV Adhesive
Epoxy Adhesive
Applications
LED MiniLED packaging and assembly materials
MiniLED/MicroLED solder paste
Die attach solder paste
SMT electronic assembly solutions
Laser/Hot bar solder paste
Lead-free SMT solder paste/Low-temperature lead-free solder paste
Leaded SMT solder paste
Semiconductor packaging materials
Rosin water-wash formic acid no-clean sintered copper
Photovoltaic new energy materials
HJT low-temperature paste
IBC insulating adhesive
PV module solder paste
Service Support
Technical Support
Sample Application
Agent recruitment
Contact Us
Contact
Join Us
English
Chinese
English
Vietnamese
Thai
GO
Current position：
Home
-
Applications
About Us
Company Overview
Development path
Company News
Enterprise honor
Product Center
Lead-free Series
Leaded Series
Formic Acid Series
COB Adhesive
LED Filament Adhesive
Other Adhesives
Applications
LED MiniLED packaging and assembly materials
SMT electronic assembly solutions
Semiconductor packaging materials
Photovoltaic new energy materials
Service Support
Technical Support
Sample Application
Agent recruitment
Contact Us
Contact
Join Us
Official WeChat
online
service
online service
time：
09:00-17:00
0512-62834900
Earlysun Online
Consult now
Official WeChat