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Earlysun Technology made a grand appearance at AUTO TECH 2019 China International Automotive Technology Exhibition with its core productsRelease time:2019-05-08

AUTO TECH 2019 The China International Automotive Technology Exhibition will kick off tomorrow at the Wuhan International Expo Center (Hanyang). As an important exhibition in the field of automotive pre-installation in China, it mainly covers automotive electronics technology, Internet of Vehicles technology, EV/HEV technology, automotive lightweight technology, autonomous driving technology, automotive testing and measurement technology, < span>5G technology application and many other key topics, the exhibition lasts for 3 days, starting tomorrow May month 9 until May month 11.



Exhibitor: Earlysun Technology Co., Ltd.

Booth number:B2-655

Exhibition time:5month9Day-5month11Day

Exhibition location: Wuhan International Expo Center (Hanyang)   


      Development Trend of Electronic Packaging Materials Industry

 With the rapid advancement of intelligent, multimedia, and networked electronic application technologies, the global electronics manufacturing industry is entering a period of intensive innovation and rapid development of emerging enterprises. Electronic products are increasingly developing in the direction of short, small, light, and thin, causing packaging devices to also have to transform into smaller, thinner, faster, more convenient, and more reliable structural trends to adapt to changes in market demand. Therefore, high-precision and high-reliability electronic packaging materials have become an inevitable choice nowadays. Whoever can adapt to the market to the greatest extent will lead the future electronic packaging materials industry.


Introduction to Earlysun Technology



Shenzhen Earlysun Technology Co., Ltd. is committed to the innovation of semiconductor packaging materials, LED packaging materials, and electronic assembly materials. It is a national high-tech representative enterprise in the field of electronic fine chemicals. Earlysun Technology is the first to propose a solution provider for flip-chip packaging solid crystal solder paste and flip-chip fruit powder glue in the field of LED packaging. Its main products include lead-free solder paste, high-lead solder paste, silicone gel, etc.



Earlysun Technology takes promoting the technological progress of the materials industry as its mission, constantly innovates, and continuously increases investment in key links of the industrial chain. The preparation and application technology of solid crystal solder paste has reached the international advanced level. It provides products and technical services to many packaging companies in the industry, and has won widespread praise from customers, and its market share has grown steadily. Not only that, Earlysun Technology insists on advancing with the times, constantly adapting to changes in market demand, laying out plans in advance before trends arrive, always grasping the pulse of the market, and has unlimited potential.




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