Earlysun Technology brings key packaging materials to help Mini LED transform into a new era
As a national high-tech enterprise in the field of electronic fine chemicals, Earlysun Technology is committed to the innovation of semiconductor packaging materials, LED packaging materials, and electronic assembly materials. It is the first solution provider to propose flip-chip packaging solid crystal solder paste and flip-chip fruit powder glue in the field of LED packaging.
On June 10, the mainstream media --- expert Talk invited Mr. Qian Xuexing of Earlysun Technology to attend the advanced lighting and LED new display trend analysis meeting.
At the meeting, Mr. Qian from Earlysun Technology answered the host’s questions about the two most common problems in the Mini display process --- solder paste printing and soldering. The latest EM-6001 series of die-hardening solder pastes launched by Earlysun Technology can solve all the above problems by repeatedly adjusting and verifying the formula and process parameters of the solder paste. Currently, the SPI detection defect rate after printing can be zero, and the void rate after welding is less than 3%. The chip welding thrust has been greatly improved, and in addition to EM-6001, there are also two types of products: EM-7001 and EM-8001. Their basic properties are the same except for the size of the fruit powder and the viscosity of the solder paste (flux ratio).
At present, for most manufacturers, the biggest challenge is to increase the yield and consistency in mass production. Earlysun Technology's EM-7001 and EM-8001 two solder pastes with smaller particle sizes can perfectly solve these two problems and can help solve the problem of Micro level fine pitch packaging.
In addition, Earlysun Technology has also done a lot of testing in the area of electronic packaging. The two types of silicone encapsulants launched, methyl and phenyl, have also achieved great success in panel packaging.
With continuous innovation and R&D investment, Earlysun Technology has been deeply involved in the field of electronic materials in 15, constantly adapting to new market situations and new demands, and has repeatedly set new highs in the domestic electronic materials industry market share. At present, Earlysun Technology's two core products have become popular in the electronic packaging material product market that is increasingly trending towards high precision, high reliability and high efficiency.
Earlysun Technology actively responds to new opportunities and challenges in the market, continuously increases the pace of research and development, and makes forward-looking domestic electronic packaging layout in the rapidly changing market environment. When the Mini LED era puts forward new requirements for solder paste technology, Earlysun Technology can quickly seize this development opportunity and strive to provide Mini
LED provides solutions, and Earlysun Technology has a bright future. I sincerely wish that Earlysun Technology will get better and better.
