March 19,"2020 High-tech New Display National Tour Survey"The team visited Earlysun Technology and discussed with the general manager of Earlysun Technology onMini/Micro LED packaging material technology and market issues.
As the advantages of Mini LED and Micro LED technology in the display field become more and more obvious. Many people in the industry believe that Mini LED display and Micro LED display will be higher-end display technologies and will also be the development trend of future display applications.
EspeciallyMini LED was once considered a transitional product before Micro LED mass production. Now it shines with its innovation, functionality and cost-effectiveness and has become the "new favorite" of LED display companies, panel manufacturers and leading terminal consumer electronics companies.
高工LED Chairman Dr. Zhang Xiaofei also pointed out,
Although the Mini LED market is booming, its technical barriers cannot be ignored.
Since the chip size of Mini LED is mainly 50-200um. LED chips and lamp beads use a huge amount per unit area and are arranged very closely, which puts forward higher requirements for welding surface flatness and circuit accuracy. The requirements for the adaptability of welding parameters and packaging tolerance are also stricter.
However, traditional solder paste solidification can easily cause chip welding drift and increase the porosity, which cannot meet the high-precision solidification requirements of Mini LED. Therefore, Mini LED packaging technology puts forward four requirements for solder paste, namely solder paste and printing technology, mass transfer technology, new die-holding technology, and integrated packaging technology.
It is worth noting that solder paste technology has always been mainly in the hands of foreign brands such as Alpha, Indium Corporation, and Heraeus, posing huge challenges to domestic material manufacturers.
In order to break the existing monopoly,Earlysun Technology, as a leading company in domestic packaging materials, has taken the lead inMini LED field and has taken the lead in developing a series of Mini packaging solder paste solutions.
Mr. QianIntroduction, "Currently, Earlysun’s Mini The packaging solder paste products mainly include 4 series, namely EM-9351 series, EM-6001 series, EM-7001 series, and ES-1100 series. ”
EM-9351 series is a low-temperature system solder paste, mainly used for Mini LED lamp beads and MOS tube welding; EM-6001 series is solid crystal solder paste, mainly used for Mini BLU lamp bead solid crystal packaging; EM-7001 series is also a solid crystal solder paste, mainly used for Mini RGB smaller size chip welding; ES-1100 series is a high temperature solid crystal solder paste, mainly used for Mini BLU lamp bead chip solid crystal welding, meeting the requirements for secondary reflow.
"Currently, our Mini packaging solder paste products can meet most Mini packaging in the industry, and customer production is also supported by this product."Mr. Qian pointed out that "Although Earlysun's starting point is lower than that of foreign countries, after accumulation and innovation in recent years, today's technology is not inferior to foreign countries, and even surpasses foreign countries."
In addition to solder paste, glue is also one of the key materials in the Mini packaging process. In the field of lighting, domestic glue has basically replaced imported glue, and the price has become very cheap. However, in the field of display, there are currently no representative manufacturers at home and abroad.
Regarding this situation, Earlysun Technology will launch another "attack". Mr. Qian said, "Earlysun will closely follow the development of technology and customer needs and launch new solutions, which not only ensures that the substrate is not easy to lift, but also ensures high chip bonding strength and improves the yield of client packaging products."
According to reports, the new solutions are GH1010 and GH1030 modified glue used in the Mini BLU field, for Mini GZ2020 and GZ2040 glue that solves the problem of ink color consistency in the RGB field.
From this point of view, Earlysun Technology has completed the upgrade from LED lighting packaging material technology to display packaging material technology, and has successfully opened up a new track. "In terms of Mini LED material technology, Earlysun has every opportunity to continue to surpass international competitors. In terms of Mini LED material supply, Earlysun is also well prepared." Mr. Qian mentioned last.
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