With the global spread of the COVID-19 epidemic,there are countless industries affected by the epidemic.The electronic product manufacturing industry is the first to bear the brunt, and the field of packaging materials, as a key link in electronic product manufacturing, is no exception. Earlysun Technology, as a leading brand in the field of domestic electronic packaging materials, has withstood the impact of the epidemic with high-quality products, services and good market reputation. During the epidemic, not only did it not suffer any obvious losses, but it maintained steady growth. This is inseparable from the results achieved by Earlysun Technology's insistence on innovative research and development. In order to promote the common progress of packaging materials and inspire new R&D inspiration and ideas, Earlysun Technology specially shares its latest R&D technologies and product solutions, exchanges and learns from each other, contributes its own small efforts to the resumption of work and production in the later stages of the epidemic, and helps the rapid advancement and implementation of import substitution.
The global electronics manufacturing industry is entering a period of intensive innovation and rapid development of emerging companies. Electronic products such as 5G communications and smartphones are becoming increasingly miniaturized and require high precision. As electronic products develop in the direction of being shorter, smaller, lighter and thinner, it has triggered a structural shift in packaged devices towards smaller, thinner, faster, more convenient and more reliable structures. In order to adapt to market demand, Earlysun Technology has successfully developed a series of solder pastes such as laser welding and Haba welding. This type of product is perfectly adapted to the requirements of special assembly and welding scenarios such as connectors, coils, optical communications, and audio for 3C and 5G products, and is completely comparable to similar foreign manufacturers.
The EL-S5/EH-S3 series is a lead-free, no-clean, completely halogen-free solder paste that is perfectly adapted to fast welding processes such as laser, Haba soldering, hot air guns and soldering irons. During welding, it can quickly stimulate and release the activity required for welding, and can agglomerate tin powder, rarely causing spatter, solder balls and bridging defects. The residue after welding is minimal and transparent, with low voids, and has extremely high reliability.
The MS-S5/MS-D5 series is a lead-free, no-cleaning, completely halogen-free solder paste.UsingSAC305 and Sn90Sb10 alloys respectively. It is suitable for MEMS high noise resistance, low residue and secondary reflow requirements. The product viscosity changes little over a long period of time, the dispensing is uniform, and the solder joint surface after welding is bright, with low voids and high reliability!
Earlysun Technology, has 16 years of experience in the field of electronic packaging materials. It is committed to the innovation of semiconductor packaging materials, LED packaging materials, and electronic assembly materials. SMT solder paste, LED flip-chip solder paste, Mini solder paste, MEMS solder paste, IGBT solder paste, leading the electronic materials industry to achieve a revolutionary leap, meeting the needs of different users for advanced electronic packaging materials, and developing in innovation! We sincerely recruit aspiring agents to work together to create a win-win future!
