The annual 3·15 is here as scheduled. Some brands are happy and some are worried. It is not a problem for brands to become famous overnight after being exposed. For most honest and pragmatic companies and brands, there is no need to worry or worry. 3·15 is just a good day to clear up justice in the industry. Earlysun Technology, as a leading brand in the domestic electronic packaging materials industry, must set a good example for the development and progress of the industry, resolutely resist counterfeiting, and effectively defend the legitimate rights and interests of every customer with quality and service.
The reason why counterfeit goods can be confused with real people is that in addition to the increasingly sophisticated methods of counterfeiting and imitation, as a party that is easily deceived, it is more important to strengthen the ability to distinguish authenticity and quality, rather than passively "letting others slaughter". Below, Earlysun Technology uses solid crystal solder paste as an example to tell you how to better identify its quality and authenticity. When it comes to solder paste, it has to be Earlysun Technology. As the earliest solder paste product developed by Earlysun Technology when it was founded, after more than ten years of continuous iteration and optimization, its quality has become more and more outstanding, and it is completely comparable to well-known foreign brands. Let’s learn how to identify the quality of solder paste with Earlysun Technology.
1. Viscosity
Solid crystal solder paste is a thixotropic fluid that can flow under the action of external force. Viscosity is the main characteristic index of the solid-crystal solder paste, and it is an important factor affecting the printing performance: if the viscosity is too high, the solid-crystal solder paste will not easily penetrate the leaky holes of the template, and the printed graphics will be incomplete. The main factor affecting the viscosity of the solder paste is the percentage content of the tin powder. The higher the alloy content, the greater the viscosity.
2. Thixotropic index and slump
The solid crystal solder paste is a thixotropic fluid, and the slump of the solid crystal solder paste is mainly related to the viscosity and thixotropy of the solder paste. The thixotropy index is high and the slump is small; the thixotropy index is low and the slump is large.
3. Tin powder ingredients/Auxiliary composition
Tin powder composition / The composition of additives and the ratio of tin powder to flux are key parameters that determine the melting point, printability, solderability and solder joint quality of solder paste. Generally, tin powder alloy components are required to be eutectic or near-eutectic as much as possible. The ratio of tin powder to flux is expressed as the weight percentage of tin powder in the solder paste.
4. Tin powder particle size/Shape and distribution
The size, shape and uniformity of tin powder particles are important parameters that affect the performance of solder paste, affecting the printability, demoldability and solderability of solid crystal solder paste. Tiny-particle solder paste has better printability, especially for high-density, narrow-pitch products. The shape of the alloy powder also affects the printability, mold release and solderability of the solid crystal solder paste. The solder paste composed of spherical particle alloy powder has a low viscosity. The solder paste pattern is easy to collapse after printing. It has good printability and a wide range of applications. It is especially suitable for high-density narrow-pitch screen and metal stencil printing, and is also suitable for drop pattern printing.
