Auto PCBA Reliability |
Earlysun Technology Defines "Standing the Test" with Real Data
🛡️ Extreme Environment Testing · Zero Defect Standard · Heart of Auto Electronics
In the core field of automotive electronics, PCBA (Printed Circuit Board Assembly) reliability is a key line of defense safeguarding driving safety. As vehicles drive continuously in high-temperature and high-humidity environments, PCBA endures severe tests with excellent performance. As a practitioner of automotive electronics reliability, Earlysun Technology Co., Ltd. interprets product strength with "hardcore data".
I. Extreme Environment "Stress Resistance": Dual Test of Thermal Shock × Damp Heat
1. Thermal Shock Test: Tempering in Ice and Fire to Verify Limit Adaptability
🧊 Simulation Scenario: Replicate extreme conditions where vehicles switch frequently between frigid plateaus and scorching deserts, testing PCBA stability during sudden temperature changes.
✅ Result: Precise 3D X-ray detection shows no cracking or bridging in solder joints, meeting strict industry acceptance standards and achieving "zero defects" under the test of "ice and fire".
2. Damp Heat Cyclic Test: "Endurance Certification" in Prolonged High Humidity
💧 Simulation Scenario: Benchmarking against the rainy season in the south and coastal high-humidity environments to verify PCBA's anti-aging and moisture-proof capabilities.
✅ Result: Solder joint void rate is far below the industry allowed threshold, and there are no connection cracking issues, performing "steady as a rock" in high humidity environments.
II. Vibration Condition "Steady Core": Structural Reliability under Multi-Dimensional Vibration
Vibration Test: "Zero Displacement" Perseverance under All-Terrain Bumps
🚗 Simulation Scenario: Replicate the complex stress environment of high-frequency vibration during high-speed driving and multi-directional impacts on complex road conditions, superimposed with temperature cycling.
After the test, there were no abnormalities in appearance, components showed "zero detachment, zero displacement", and functional inspection was 100% qualified, perfectly resisting the dual test of "vibration + temperature difference".
III. "Microscopic Level" Control of Soldering Process: Quality Demands under Metallographic Slicing
Metallographic Slicing Analysis: "X-ray Inspection" of Solder Joint Quality
🔬 Core Findings: Solder joints show no cracks or cold soldering, pin wetting is full and uniform, with only local tiny voids that do not affect conductivity and mechanical performance. The soldering process reaches "zero defect" level standards, demonstrating excellence in details.
❓ IV. Why are the above tests "Mandatory Questions" for Reliability?
- 1. Damp Heat Cyclic Test: Verify the moisture-proof capability of the circuit board when used in rainy seasons or high-temperature areas, avoiding short circuits or performance degradation caused by humidity.
- 2. Thermal Shock Test: Simulate the rapid switching of vehicles from extreme cold to high-temperature environments (such as rapid heating after starting in winter) to ensure structural and electrical performance stability of PCBA under sudden temperature changes.
- 3. Vibration Test: Ensure the firmness of components on bumpy roads while driving, avoiding functional failures caused by loosening, which is an important guarantee for driving safety.
V. Earlysun Electronic Assembly Packaging Material Solution
Based on the above needs, Earlysun Technology launched the electronic assembly packaging solder—Lead-free No-clean Solder Paste X4. Developed for high-precision SMT processes, it uses high-purity lead-free alloy solder powder and ROL0 grade carrier formulation.
✨ X4 Solder Paste Four Core Features:
- A. Relatively low surface tension in liquid state, conducive to pad wetting and component pin climbing;
- B. Low volatile solvent system, good moisturizing property, wide operating window, good consistency in continuous printing;
- C. Good slump resistance, no solder balls, no bridging defects, extremely low residue and transparent;
- D. Formula uses composite active system, solder joints are bright, less wrinkled, and have low voids.
Building a Reliability Cornerstone with "Real Data"
From temperature differences spanning -40℃ to 120℃, from high-frequency vibration to high humidity erosion, Earlysun Technology has demonstrated a "reliability first" R&D philosophy with excellent results passing all four tests.
Choosing Earlysun Technology means choosing quality assurance that can withstand extreme tests, safeguarding every journey.
