Current position:Home - About Us - Company News

Service & Support - Core of Solder Paste Lifespan Management: Professional Standards for Refrigeration and RewarmingRelease time:2025-12-19

Core of Solder Paste Lifespan Management:
Professional Standards for Refrigeration and Warming

⚙️ Earlysun Tech Post · Process Standards · Quality Assurance

The "effective lifespan" of solder paste is determined by both "factory shelf life" and "process control lifespan". From factory transportation and warehouse refrigeration to workshop warming and machine usage, parameter deviations at every link will directly affect its soldering performance. As a high-tech enterprise in the field of electronic soldering materials, Earlysun Technology will systematically interpret the core technical specifications for solder paste refrigeration and warming, helping enterprises maximize the value of solder paste.

❄️ I. Refrigeration: The "Freshness Password" Hidden in Temperature

As a colloidal dispersion system of solder powder and flux, components like rosin resin and organic acid activators in the flux are extremely sensitive to temperature. The quality management system clearly requires that solder paste storage must adhere to "low temperature constant temperature" control standards.

Earlysun Technology Precise Refrigeration Standard

0-10℃ Constant Temp
40%-60% RH Constant Humidity

✅ Effect: Flux aging rate reduced, shelf life of unopened solder paste stably reaches 6-12 months.

🚨 Key avoidance of two major storage misconceptions:
  • Strictly prohibit freezing below 0℃: Low temperature causes flux crystallization and separation, which cannot be restored after thawing, causing irreversible damage.
  • Strictly enforce FIFO: Refrigerated inventory needs "First In, First Out". Earlysun solder paste jars contain production dates and expiration warnings to avoid waste from expiration.

🌡️ II. Warming: Controlling Heat Exchange Rate is Key

Using refrigerated solder paste immediately after opening is a key cause of soldering defects. The temperature difference causes condensation to form rapidly on the inner wall of the jar, which in turn leads to increased porosity in solder joints. The scientific warming process must follow the principle of "slow uniform speed, sealed moisturizing".

1 Sealed Constant Speed Warming

Keep the solder paste sealed after removal, and place it in a 20-25℃, 40%-60% RH environment to warm up naturally. Avoid direct sunlight and direct air conditioner blowing, ensuring the temperature rises uniformly. A temperature difference of ≤1℃ with the environment is considered compliant.

2 Strictly Prohibit Forced Heating

Do not use ovens, heat guns, or warm water soaking. Such operations cause excessively high local temperatures, triggering thermal decomposition of the flux, which easily leads to slumping and bridging defects during printing.

3 Quality Inspection Before Opening

After warming is compliant, wipe the condensation from the outer wall. Open the lid to observe: it should be a uniform milky gray paste, free of particles, separation, and crusting; when lifted, it should form continuous fine filaments.

Every performance degradation of solder paste is directly related to deviations in operational details.

Earlysun Technology is deeply engaged in the R&D and industrialization of electronic soldering materials, always taking "data supporting standards, technology guaranteeing quality" as the core, optimizing both production costs and quality risks from solder paste formula design to full-process control services.


online
service
online service
  • time:
    09:00-17:00
    0512-62834900
  • Earlysun Online
    Consult now