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Technology Frontiers - Key Materials in Electronics Manufacturing: Comprehensive Analysis of Solder Paste Physical Property TestingRelease time:2025-12-19

Key Materials for Electronics Manufacturing:
Comprehensive Analysis of Solder Paste Physical Properties Testing

—— How do Viscosity, Metal Content, and Particle Size Affect Welding Quality?

The physical properties of welding materials directly determine the reliability and stability of products. Earlysun Technology Co., Ltd. controls product quality with strict standards, especially in the physical property testing of solder paste, ensuring that every product meets the highest industry requirements through scientific methods and advanced equipment.

I. Viscosity Test: The "Lifeline" of Printing Process

Solder paste viscosity is a key indicator affecting printing and welding results. Earlysun Technology uses Malcom viscometers for testing, strictly following these conditions:

  • • Typical Range: 80~200kcps (dynamically adjusted based on alloy type and particle size)
  • • Test Conditions: 25±0.5℃ constant temperature environment
  • • Standard Basis: Viscosity values must comply with IPC-J-STD-005 standards and manufacturer specifications
Through precise viscosity control, Earlysun solder paste significantly improves printing yield, welding reliability, and production efficiency, avoiding defects like clogged apertures and collapse caused by viscosity anomalies.

II. Metal Content Test: The "Golden Ratio" for Conductivity and Strength

Earlysun Technology calculates the metal proportion (weight percentage) by weighing after heating and volatilizing the flux:

  • • Typical Range: 88%~92% (slightly lower for lead-free solder paste)
  • • Conductivity: Metal content ≥90% ensures low resistance connection
  • • Welding Strength: Insufficient metal proportion reduces shear resistance
Rigorous testing balances welding quality, process compatibility, and cost-effectiveness, which is indispensable in high-reliability fields like automotive and medical.

III. Solder Powder Particle Size Test: Microscopic Determines Macroscopic Performance

Solder powder particle size directly affects solder paste printability, welding reliability, and solder joint quality. Earlysun Technology strictly implements the IPC-J-STD-005 standard:

Common Specifications:

  • Type 3 (25~45μm): General purpose, suitable for conventional packaging like QFP/SOP
  • Type 4 (20~38μm): High-density IC
  • Type 5 (10~25μm): For ultra-fine pitch
Solder powder particle testing directly impacts yield and product life. Strict screening of particle distribution significantly reduces process fluctuations, meeting high-precision, high-reliability electronics manufacturing needs.

Conclusion

From viscosity to particle size, from metal content to welding strength, Earlysun Technology provides reliable welding material solutions for the electronics manufacturing industry with scientific testing methods and rigorous quality control.


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