Earlysun Technology | Pulsing Future
Leading Packaging Shines at 2025 Global Automotive Power Semiconductor Summit
📍 Hangzhou · GAPS 2025
From May 15th to 16th, 2025, the 2025 Global Automotive Power Semiconductor Summit (GAPS), themed "Car Starts Core Era, Leading Core Future," concluded successfully in Hangzhou! This industry event focusing on core technologies of new energy vehicles attracted numerous leading enterprises and hundreds of experts to explore industry frontiers. As a leader in the field of automotive-grade power semiconductor packaging materials, Shenzhen Earlysun Technology Co., Ltd. made a grand appearance with innovative technologies and solutions, igniting the summit scene!
I. Summit Focus: The "Core" Challenges and Opportunities of Automotive-Grade Power Semiconductors
With the explosion of the new energy vehicle industry, the requirements for power devices in main drive systems are becoming increasingly strict:
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⚡ High Power Density:
Motor miniaturization and high speed create demands for "high current output" and "low loss" technologies; -
🛡️ High Reliability:
Comprehensive durability of 300,000 kilometers and device stability under high humidity, heat, and vibration environments have become core indicators; -
🚀 Technological Innovation:
SiC devices, with advantages like 3% efficiency improvement and reduced wiring harness costs, are becoming the mainstream direction to replace IGBTs.
II. Industry Consensus: Earlysun Technology Highlights
Performance breakthroughs in automotive-grade power semiconductors depend on innovative breakthroughs in packaging material technology! — Earlysun Technology defines new industry benchmarks with packaging material technology.
Earlysun Technology comprehensively demonstrated a full-chain solution for automotive-grade power semiconductor packaging materials:
💎 Core Product Matrix
Features high chemical stability and excellent demolding properties, adaptable to continuous dispensing/printing processes, with high welding yield. Meets high reliability packaging needs for automotive electronics.
Features high chemical stability suitable for continuous printing processes; ultra-low welding void rate and zero residue (environmentally friendly); high reliability, can replace traditional solder preforms.
Adapts to high power density requirements in supercharging scenarios; high thermal and electrical conductivity; pressure-assisted low-temperature sintering, low porosity; high shear strength, high service temperature.
III. Industry Linkage: Exploring the Path of Collaborative Innovation in the Industrial Chain
During the summit, Earlysun Technology engaged in in-depth discussions with many well-known enterprises to discuss the future of the industry.
Conclusion: From "Manufacturing" to "Intelligent Manufacturing"
Earlysun Technology uses packaging material technology as a pen to write Chinese power on the "Core" map of new energy vehicles! In the future, we will continue to deeply cultivate the automotive-grade market, paint the "Pulsing Future" blueprint with industrial chain partners, and make every chip the core engine driving industrial upgrading!
