Why Do Solder Beads Always Appear in Solder Paste Printing?
Have You Checked These Loopholes?
The appearance of solder beads is like a fly in the ointment, seriously affecting the quality and reliability of electronic products. Let's focus on one of the key factors in the generation of solder beads—solder paste printing issues, and Earlysun Technology will take you on a deep dive.
1. Stencil Aperture: The Key of Dimensions and Thickness
Stencil aperture design is the soul of solder paste printing; once there is a problem, solder beads easily appear. For instance, if the opening is too large, solder paste deposits excessively like a runaway horse, and during reflow soldering, excess solder will cause trouble, forming solder beads. If the thickness is too great, it will also cause solder paste volume to spiral out of control, laying hidden dangers for the birth of solder beads.
💡 Earlysun Technology Optimization Solution
- • Micron-level Precision Design: Relying on intelligent simulation systems, aperture plans are customized according to component size and pin spacing, precisely controlling stencil thickness at 0.12mm, snuffing out the source of solder beads.
- • Nano-coating Black Tech: Using exclusive nano-coating technology, the smoothness of the stencil surface is greatly improved, solder paste release resistance is greatly reduced, bidding farewell to residue worries, with high solder paste transfer rates!
2. Printing Offset and Demolding: Be Careful and Cautious
Printing offset and poor demolding are also important triggers for solder beads. If the solder paste does not precisely cover the pad, residual solder paste will gather together during reflow, turning into troublesome solder beads. In poor demolding, solder paste cannot transfer smoothly from the stencil to the pad; some paste remains on the stencil, causing deviations in subsequent printing.
💡 Earlysun Technology Optimization Solution
- • Parameter Golden Combination: Tailor-made printing parameters for different solder paste characteristics and stencil specifications: precise control of squeegee pressure and stable demolding speed to achieve "zero offset" printing.
- • Intelligent Calibration System: Paired with Earlysun Technology equipment calibration solutions to ensure printing equipment is always in optimal condition, improving printing accuracy to ±0.02mm!
3. Solder Paste Viscosity: Appropriateness is King
Solder paste viscosity must be just right. If viscosity is too low, the paste acts like soft mud, easily collapsing after printing and forming solder beads at the edge of the pad. If viscosity is too high, the paste is like a hard stone, difficult to print smoothly, leading to insufficient filling and affecting welding quality.
💡 Earlysun Technology Optimization Solution
- • Customized Solder Paste Selection: Provides a variety of solder pastes with different viscosities to adapt to different process and environmental needs. For example, in high-humidity environments, Earlysun Technology's anti-moisture solder paste is recommended for improved viscosity stability.
- • Full Process Control Solution: From solder paste storage and rewarming (intelligent temperature control system) to stirring (precise speed setting), providing a one-stop operation guide to ensure solder paste performance is always online.
Earlysun Technology Products: Secret Weapons for Solving Solder Bead Problems
Facing the solder bead problem, Earlysun Technology, with years of R&D and production experience, has launched a series of high-performance solder paste products to solve problems for electronics manufacturing enterprises.
Earlysun Technology Formic Acid Solder Paste
As a flagship product of third-generation solder paste technology, it boasts numerous advantages such as zero residue after welding, high reliability, and low void rate. In the production process, it can also omit cumbersome process steps like fixture installation and disassembly, saving costs on materials, preforms, and mold manufacturing.
It is simply the typical packaging solder for automotive-grade silicon-based chips and has been maturely applied in module packaging such as IGBT and MOSFET.
If you are still troubled by solder bead problems, why not try Earlysun Technology's products?
We believe it will bring you unexpected surprises!
