Earlysun Technology Revolutionizes Solder Paste Formula,
The Terminator of Hidden Welding Dangers is Here!
In SMT production, flux separation is often an "invisible killer"—at best causing false soldering and solder beads, and at worst triggering electrochemical corrosion, planting a reliability time bomb in high-end electronic equipment during long-term use. Earlysun Technology addresses industry pain points directly. Driven by the dual engines of material innovation and intelligent monitoring, we have created a "zero-separation" solder paste solution to safeguard precision manufacturing.
I. Multi-dimensional Threats to Welding Quality
Have you encountered these problems?
- • Short-term production troubles: The solder paste surface appears oily and layered, viscosity changes suddenly during printing, stencils clog frequently, and downtime for cleaning increases; the solder bead rate after reflow soldering soars to 8%, and complaints about false soldering on 01005 components are constant.
- • Long-term reliability risks: Loss of active flux ingredients leads to excessive solder joint void rates; residual ions cause PCB creepage in humid environments, and the insulation resistance of automotive electronic modules drops to 10⁶Ω, far below the AEC-Q100 standard.
Data shows that 15% of SMT defect rates stem from solder paste separation issues, while traditional solutions often solve one problem only to create another—Earlysun Technology attacks the separation problem at its root.
II. Material Revolution: Nano-formula Rewrites Industry Rules
The Earlysun Technology R&D team has gone through 300+ formula iterations to introduce two breakthrough core technologies:
1. Hydrogenated Castor Oil Derivative Thixotropic Agent
Builds a three-dimensional network molecular structure, suppressing the flux separation rate to below 0.5% (1/10th of the industry average). Even when stored for 3 months at 25℃ and 60%RH, it maintains excellent thixotropy, preventing component separation at the molecular level.
2. Microencapsulation Technology
Uses 50-100nm sustained-release capsules to wrap active ingredients, keeping them stable as a solid at room temperature. Flux is released layer by layer only when reflow heating reaches 120℃, avoiding solder beads and reduced wettability caused by premature volatilization. Solder joint spreading rate is increased by 20% (compared to traditional formulas).
III. Smart Monitoring: Full-Process Dynamic Anti-Separation System
Good materials need good management. Earlysun Technology creates a closed loop of "Pre-prevention - In-process Monitoring - Post-traceability":
- • Storage Stage: Equipped with intelligent temperature and humidity sensors to provide real-time warnings for anomalies outside the 2-10℃ storage range, avoiding flux activation caused by cold chain interruptions.
- • Usage Stage: Online detectors integrated with AI viscosity prediction algorithms scan solder paste rheological data every 10 seconds. When viscosity deviation exceeds 5%, an automatic warning is triggered, synchronously tracing storage duration and rewarming records to pinpoint separation risk points.
- • Process Stage: Through linked detection with X-ray and infrared spectroscopy, real-time analysis of solder joint IMC layer thickness (controlled at <3μm) and flux residue distribution ensures "zero separation, zero defects" even in QFN fine-pitch welding.
IV. Industry Verification: The Trusted Choice from Automotive Electronics to High-End Communications
🚘 A German Automotive Electronics Manufacturer:
After introducing Earlysun's anti-separation solder paste, PCBA insulation resistance increased to the 10⁹Ω level, high-temperature and high-humidity tests (85℃/85%RH, 1000h) showed zero failures, and production line downtime frequency dropped by 60%.
📡 A 5G Base Station Manufacturer:
In 0.3mm pitch BGA welding, the solder bead defect rate dropped from the industry average of 7% to 0.8%, and the reflow soldering yield exceeded 99.9%, perfectly meeting the strict requirements for solder joint cleanliness in high-frequency and high-speed signal transmission.
Conclusion: Say Goodbye to Separation Troubles, Make Welding Simpler and More Reliable
Flux separation is not an "inevitable industry ailment" but a "technical challenge yet to be conquered." Earlysun Technology breaks bottlenecks with material innovation and builds a defense line with intelligent monitoring, making every jar of solder paste the cornerstone of stable processes and every solder joint a badge of reliable quality.
Choose Earlysun Anti-Separation Solder Paste, Unlock Three Core Values:
- ✅ Production Efficiency Improvement: Reduce stencil cleaning frequency by 50%, reduce rework costs by 30%
- ✅ Yield Breakthrough: Solder joint spreading rate ≥90%, solder bead defect rate <1%
- ✅ Long-term Peace of Mind: Passed strict certifications such as AEC-Q100 and JEDEC, with 10-year reliability guarantee
