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Earlysun offers various solder paste products for electronic assembly, suitable for different application scenarios and processes, providing users with the most appropriate packaging solutions.

COB Encapsulation Adhesive

Product model chemical class Components Appearance after curing Suitable for curing conditions Viscosity after mixing (mPa.s/25℃) Hardness (Shore A) Product application
EU9315 silicone two-component Colorless, bubble-free, transparent elastomer 150℃ × 1h 3500±500 45±5
COB surface light source packaging
EU9315-2 silicone two-component Colorless transparent elastomer 150℃ × 1h 6300±500 45±5
EU9315-3 silicone two-component Colorless transparent elastomer 150℃ × 1h 4100±500 25±5
EU9316 silicone two-component Colorless transparent elastomer 150℃ × 1h 4500±500 35±5
EU9318-5 silicone two-component Colorless transparent elastomer 80℃ x 1h+150℃ x 2h 3600±500 60±5
High-power COB lamp integrated side light source package
EU9318-SD silicone two-component Colorless transparent elastomer 80℃ x 1h+150℃ x 2h 4500±500 65±5
EU9318-7 silicone two-component Colorless transparent elastomer 80℃ x 1h+150℃ x 2h 4500±500 53±5
EU9318-6 silicone two-component Colorless transparent elastomer 80℃ × 30min+150℃ × 3h 4000±300 80 Powder preparation and potting of surface light source in LED package
EU9318-5D EU9318-5 EU9315-2
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