Ø ES-500 series high lead solder paste
main feature:
l RoHS instruction is exempt from solder；
l Applicable to power tube, diode, triode,rectifier bridge, small integrated circuit and other power semiconductorprecision components package soldering；
Wideprocess window
l Lowvolatile solvent system, good thixotropy, wide operating window, consistentoperation consistency；
l high adhesion, keep the components attached
Robust reflow performance
l Wide process window, making the reflowtemperature curve flexible；
l Bestwetting on all conventional substrate surfaces.
Good welding effect
l Goodthermal collapse, no tin beads, no bridge defects, few residues andtransparent；
l The surface of the solder joint is bright, lesswrinkled, and low void.
Ø ES-650 series high
lead solder paste
main feature:
l RoHS instruction is exempt from solder；
l Applicable to power tube, diode, triode,
rectifier bridge, small integrated circuit and other power semiconductor
precision components package soldering；
Wide process window
l Low
volatile solvent system, good thixotropy, wide operating window, consistent
operation consistency；
l high adhesion, keep the components attached；
Robust reflow performance
l Wide process window, making the reflow
temperature curve flexible；
l Best wetting on all conventional substrate
surfaces.
Good welding effect
l Good
thermal collapse, no tin beads, no bridge defects, few residues and
transparent.
l The surface of the solder joint is bright, less
wrinkled, and low void
main feature：
l RoHS instruction is exempt from solder；
l Applicable to power tube, diode, triode,rectifier bridge, small integrated circuit and other power semiconductorprecision components package soldering.
Wide process window
l Low volatilesolvent system, good thixotropy, wide operating window, consistent operationconsistency；
l high adhesion, keep the components attached.
Robust reflow performance
l Wide process window, making the reflowtemperature curve flexible；
l Bestwetting on all conventional substrate surfaces；
Good welding effect
l Goodthermal collapse, no tin beads, no bridge defects, few residues andtransparent；
l The surface of the solder joint is bright, lesswrinkled, and low void
