l COB enclosure for LED surface light
source for ideal wall shape；
l Inner layer
bonding for PTC, bonding of electronic, electrical and instrument components；
l Used for
bonding, bonding, and fixing various electronic components；
l Good adhesion
and moderate strength;
l moisture-proof, waterproof, ozone-resistant, radiation-resistant,
weather-resistant, etc., can withstand high temperatures 260 ° C;
l Heated and
cured, and has good adhesion to substrates such as epoxy, glass, and metal.
|
inspecting
item
|
Unit / test
method
|
numerical
value
|
|
surface
|
——
|
white paste
|
|
dynamic viscosity
|
MPa·s/(25℃，10rpm)
|
28-35
|
|
Tectonic
viscosity ratio
|
/(3rpm/30rpm)
|
>3
|
|
condition of
cure
|
℃/min
|
150/15-30
|
|
Operating
time at room temperature
|
hrs./(25℃)
|
48
|
|
storage time
|
months./(-10℃-0℃)
|
6
|
|
density
|
G/cm3
|
1.3
|
|
hardness
|
Shore A
|
58-60
|
|
shear strength
|
MPa
|
>1.8
|
|
tensile
strength
|
MPa
|
>3
|
|
mass
resistivity
|
Ω·cm/(23℃)
|
0.5×1014
|
|
relative
dielectric constant
|
MHz
|
3.2
|
|
thermal conductivity
|
W/mk
|
0.7
|
|
coefficient of linear expansion
|
ppm/℃(α2)
|
210
|
l COB enclosure for LED surface lightsource for ideal wall shape；
l Inner layerbonding for PTC, bonding of electronic, electrical and instrument components；
l Used forbonding, bonding, and fixing various electronic components；
l Good adhesionand moderate strength;
l moisture-proof,waterproof, ozone-resistant, radiation-resistant, weather-resistant, etc., canwithstand high temperatures 260 ° C;
l Heated and cured, and has good adhesion to substrates such as epoxy,glass, and metal.
|
inspecting item
|
Unit / test method
|
numerical value
|
|
surface
|
——
|
white paste
|
|
dynamic viscosity
|
MPa·s/(25℃，10rpm)
|
28-35
|
|
Tectonic viscosity ratio
|
/(3rpm/30rpm)
|
>3
|
|
condition of cure
|
℃/min
|
150/15-30
|
|
Operating time at room temperature
|
hrs./(25℃)
|
48
|
|
storage time
|
months./(-10℃-0℃)
|
6
|
|
density
|
G/cm3
|
1.1
|
|
hardness
|
Shore A
|
58-63
|
|
shear strength
|
MPa
|
>1.8
|
|
tensile strength
|
MPa
|
>3
|
|
mass resistivity
|
Ω·cm/(23℃)
|
0.5×1014
|
|
relative dielectric constant
|
MHz
|
3.2
|
|
thermal conductivity
|
W/mk
|
0.7
|
|
coefficient of linear expansion
|
ppm/℃(α2)
|
210
|
l COB enclosure for LED surface light
source for ideal wall shape；
l Inner layer
bonding for PTC, bonding of electronic, electrical and instrument components；
l Used for
bonding, bonding, and fixing various electronic components；
l Good adhesion
and moderate strength;
l moisture-proof, waterproof, ozone-resistant, radiation-resistant,
weather-resistant, etc., can withstand high temperatures 260 ° C;
l Heated and cured, and has good adhesion to substrates such as epoxy,
glass, and metal.
|
inspecting
item
|
Unit / test
method
|
numerical
value
|
|
surface
|
——
|
white paste
|
|
dynamic viscosity
|
MPa·s/(25℃，10rpm)
|
45-55
|
|
Tectonic
viscosity ratio
|
/(3rpm/30rpm)
|
>4
|
|
condition of
cure
|
℃/min
|
150/15-30
|
|
Operating
time at room temperature
|
hrs./(25℃)
|
48
|
|
storage time
|
months./(-10℃-0℃)
|
6
|
|
density
|
G/cm3
|
1.0-1.1
|
|
hardness
|
Shore A
|
58-60
|
|
shear strength
|
MPa
|
>1.8
|
|
tensile
strength
|
MPa
|
>3
|
|
mass
resistivity
|
Ω·cm/(23℃)
|
0.5×1014
|
|
relative
dielectric constant
|
MHz
|
3.2
|
|
thermal conductivity
|
W/mk
|
0.7
|
|
coefficient of linear expansion
|
ppm/℃(α2)
|
210
|
l COB enclosure for LED surface light
source for ideal wall shape；
l Inner layer
bonding for PTC, bonding of electronic, electrical and instrument components；
l Used for
bonding, bonding, and fixing various electronic components；
l Good adhesion
and moderate strength;
l moisture-proof, waterproof, ozone-resistant, radiation-resistant,
weather-resistant, etc., can withstand high temperatures 260 ° C;
l Heated and cured, and has good adhesion to substrates such as epoxy,
glass, and metal.
|
inspecting
item
|
Unit / test
method
|
numerical
value
|
|
surface
|
——
|
white paste
|
|
dynamic viscosity
|
MPa·s/(25℃，10rpm)
|
35-45
|
|
Tectonic
viscosity ratio
|
/(3rpm/30rpm)
|
>4
|
|
condition of
cure
|
℃/min
|
150/15-30
|
|
Operating
time at room temperature
|
hrs./(25℃)
|
48
|
|
storage time
|
months./(-10℃-0℃)
|
6
|
|
density
|
G/cm3
|
1.0-1.1
|
|
hardness
|
Shore A
|
55-60
|
|
shear strength
|
MPa
|
>1.8
|
|
tensile
strength
|
MPa
|
>3
|
|
mass
resistivity
|
Ω·cm/(23℃)
|
0.5×1014
|
|
relative
dielectric constant
|
MHz
|
3.2
|
|
thermal conductivity
|
W/mk
|
0.7
|
|
coefficient of linear expansion
|
ppm/℃(α2)
|
210
|
