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UV glue、Epoxy adhesive、Red glue

How to choose the most suitable solder paste, please contact us. Our product engineers will be happy to help you.

SAC305 series

The company provides a variety of solder paste products for electronic assembly, adapt to a variety of application scenarios and processes, to provide users with the most suitable packaging solutions.
Solder paste
Alloy
application
X4/X5

Sn96.5Ag3Cu0.5

4#/5#
Suitable forhigh-precision SMT process technology such as automotive electronics and mobilecomputers
EL-S5

Sn96.5Ag3Cu0.5(5#)

Suitable for rapidwelding process such as laser, Haba welding, hot air gun and soldering iron
EH-S3

Sn96.5Ag3Cu0.5(3#)

Suitable for Mini LEDprinting and dispensing process
EM-6001

Sn96.5Ag3Cu0.5(6#)

Suitable for Mini LEDprinting and dispensing process
EM-7001

Sn96.5Ag3Cu0.5 (7#)

Suitable for Mini LEDprinting and dispensing process
EM-8001

Sn96.5Ag3Cu0.5 (8#)

Suitable for Mini LEDprinting and dispensing process

ES-1000

ES-1200

Sn96.5Ag3Cu0.5

(5#/6#)
Suitable for flipchip LED solid crystal, printing process
X4/X5 EL-S5 EH-S3 EM-6001 EM-7001 EM-8001 ES-1000 ES-1200
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