l SnAg0.3Cu0.7 low silver tin powder,cost-effective；
l Strong moisturizing ability, good solderwettability for various devices and pads；
l The physical connection performance of solderjoints is reliable, the chemical properties of resin residues are stable, andthe electrical parameters of high precision and high reliability are met..
Suitable for micro components and fine pitch assembly
l Meet the ultra-fine pitch printing processrequirements.
Best printing performance
l Lowvolatile solvent system, good thixotropy, wide operating window, consistentoperation consistency；
l high adhesion, keep the components attached.
Robust reflow performance
l Wide process window, making the reflowtemperature curve flexible；
l Bestwetting on all conventional substrate surfaces
Good welding effect
l Goodthermal collapse, no tin beads, no bridge defects, few residues andtransparent.；
l The surface of the solder joint is bright, lesswrinkled, and low void.