Our company brings key packaging materials to help transform the new era of Mini LED
As
a national high-tech enterprise in the field of electronic fine chemicals,
Chenri Technology is committed to the innovation of semiconductor packaging
materials, LED packaging materials and electronic assembly materials. It is the
first to propose flip-chip packaging of solid crystal solder paste and
flip-chip in the field of LED packaging. Solution provider with fruit powder
glue.
At the meeting, the
morning technology money always showed the two most common problems on the
process of the Mini---the printing problem of solder paste and the soldering
problem of solder paste. The latest EM-6001 series of solid crystal solder
paste from the morning technology can solve the above problems by repeatedly
adjusting the formulation and process parameters of the solder paste. At
present, the SPI detection failure rate after printing can be zero. The post
void rate is less than 3%. The chip soldering thrust is greatly improved, and
in addition to the EM-6001, there are two types of products, EM-7001 and
EM-8001. The basic performance is the same except for the size of the fruit
powder and the viscosity of the solder paste (flux ratio).
At present, for most
manufacturers, mass production is the biggest challenge. The problem is to
improve the yield and consistency. The morning EM-7001 and EM-8001 powders with
smaller particle size can Solve these two problems perfectly and help solve the
problem of Micro-level fine pitch packaging.
In addition, the
company has also done a lot of tests on the electronic package. The
introduction of the two kinds of silicone and phenyl silicone encapsulants has
also achieved great success in panel packaging.
With continuous
innovation and R&D investment, Chenri Technology has been deeply
cultivating the field of electronic materials for 15 years, constantly adapting
to the new situation and new demands of the market, and has made new highs in
the market share of the domestic electronic materials industry. At present, the
two core products of Chenri Technology have become the market for electronic
packaging materials products that are increasingly becoming more sophisticated,
highly reliable and highly efficient.
