This series of materials is specifically designed for high-reliability applications, suitable for MOSFET, IGBT, SiP packaging, semiconductor packaging, aerospace, medical, military industries with high post-weld residue requirements, and automotive-grade product application fields such as BMS main control PCBs, MCU/MOSFET, VCU main control chips, OBC/DCDC modules.
I. Rosin-Type and Water-Washable Solder Paste
| Representative Products | Main Alloys | Core Applications |
|---|---|---|
ES-510, ES-660, ES-W800
|
Sn5Pb92.5Ag2.5Sn10Pb90Sn96.5Ag3Cu0.5
|
Semiconductor packaging, power devices, IGBT, aerospace, medical, military, etc. |
ES-510-SP High-Lead Solder Paste
This product is a high-lead solder paste for power semiconductor packaging and welding, using Sn10Pb90 alloy, which can meet customers' precision printing process requirements, applied to packaging and welding of power tubes, diodes, transistors, rectifier bridges and other products.
- Wide operating window, classified as an exempt solder under RoHS directive.
- Good consistency in long-term printing, excellent demolding property, meets the mounting of micro-grain sized chips.
- Good solderability, high online yield, solder joint void rate below 10%.
- Residues contain halogen, cleaning is required after soldering, easily soluble in organic solvents.
- After soldering, solder joints are full, bright, high strength, with superior electrical performance.
ES-660-SPA High-Lead Solder Paste
This product is a high-lead solder paste for precision power semiconductor component packaging and welding, which can meet automated dispensing and printing processes, applied to power tubes, diodes and other products, with extremely low void rate.
-
Uses imported
Sn5Pb92.5Ag2.5tin powder, classified as an exempt solder under RoHS directive. - Chemically stable, can meet long-term dispensing and printing requirements.
- Good solderability, solder joint void rate below 10%, solder joints are full, bright, high strength after soldering.
- Residue has high insulation resistance, can be used for no-clean process, and is easily soluble in organic solvents.
ES-W800 Series Water-Washable Lead-Free Solder Paste
This series is a water-washable lead-free solder paste, suitable for IGBT, thick film circuits, SiP packaging and other soldering applications, meeting extremely low void rate and high reliability requirements.
-
Offers various lead-free alloy combinations, such as
Sn96.5Ag3Cu0.5,Sn99Ag0.3Cu0.7, etc. -
Representative alloy
Sn96.5Ag3Cu0.5has low surface tension, which is beneficial for pad wetting and solder climb. - Low volatility system, good moisture retention, wide operating window, good continuous printing consistency.
- Residues after reflow soldering are completely water-soluble, no residue after cleaning, low corrosivity to components.
II. Formic Acid Solder Paste
| Representative Products | Main Alloys | Core Applications |
|---|---|---|
JS-668, JS-880
|
Sn5Pb92.5Ag2.5Sn96.5Ag3Cu0.5
|
IGBT, semiconductor packaging, aerospace, and other industries requiring zero residue after soldering. |
JS-668 High-Lead Formic Acid Solder Paste
This product is a high-reliability high-lead formic acid solder paste for packaging and welding of power devices such as IGBT and MOSFET. Through formic acid reducing atmosphere reflow, it meets ultra-low void rate and extremely low residue requirements, and can replace solder preforms.
- Zero residue, can replace solder preforms, no cleaning required, significantly reduces costs.
- Good solderability, high online yield, and ultra-low solder joint void rate.
- High metal content, full, bright, high strength solder joints.
- Chemically stable, good fluidity, meets long-term dispensing and printing operation requirements.
- Applicable heating method: formic acid vacuum furnace.
JS-880 Lead-Free Formic Acid Solder Paste
This product is a high-reliability lead-free formic acid solder paste, using high-purity Sn96.5Ag3Cu0.5 alloy solder powder. Through formic acid reducing atmosphere reflow, it meets the ultra-low void rate and zero residue requirements for automotive-grade power devices.
- Zero residue, can completely replace existing cleanable solder pastes and solder preform processes, achieving no-clean high reliability.
- Good solderability, high online yield, and ultra-low solder joint void rate.
- Chemically stable, good fluidity, meets long-term dispensing and printing operation requirements.
- Applicable heating method: formic acid vacuum furnace.
III. No-Clean Solder Paste
| Representative Products | Main Alloys | Core Applications |
|---|---|---|
JS-668-M, JS-880-M, JS-950-M
|
Sn5Pb92.5Ag2.5Sn96.5Ag3Cu0.5Sn95Sb5
|
IGBT, semiconductor packaging, and other industries requiring extremely low residue after reflow in an inert atmosphere. |
JS-668-M High-Lead No-Clean Solder Paste
High-reliability high-lead no-clean solder paste for power device packaging and welding. Through reducing/inert atmosphere reflow, it leaves extremely low residue and meets ultra-low void rate welding requirements for IGBT and automotive-grade power devices.
- Extremely low residue, high residue insulation resistance, can be used for no-clean process (requires customer verification).
- Good solderability, high online yield, and extremely low solder joint void rate.
- High metal content, full, bright, high strength solder joints.
- Good automatic dispensing stability, minimal viscosity change, consistent dispensing volume.
JS-880-M Lead-Free No-Clean Solder Paste
High-reliability lead-free no-clean solder paste, using Sn96.5Ag3Cu0.5 alloy solder powder. Through reducing/inert atmosphere reflow, it meets the ultra-low void rate requirements for automotive-grade devices.
- Very little residue, high insulation resistance, can be used for no-clean process (requires customer verification).
- Good solderability, ultra-low solder joint void rate.
- Good automatic dispensing stability, minimal viscosity change, high consistency in dispensing volume.
JS-950-M High-Temperature Lead-Free No-Clean Solder Paste
High-reliability high-temperature lead-free no-clean solder paste, using Sn95Sb5 alloy (melting point 235-245℃), meeting process requirements for higher melting points.
- Extremely low residue, can to some extent meet the no-clean requirements of the manufacturing process.
- Good solderability, high reliability, and extremely low solder joint void rate.
- Chemically stable, good fluidity, meets long-term dispensing and printing operation requirements.
IV. Sintered Copper Paste
CS-100 Nano Low-Temperature Sintered Copper Paste
CS-100 is a nano low-temperature sintered copper paste, designed for SiC module pressure sintered packaging. It exhibits excellent bonding strength, thermal conductivity, and electrical conductivity to metal surfaces such as copper, silver, and gold, making it the preferred packaging material for third-generation SiC semiconductors.
- High thermal and electrical conductivity performance.
- Pressure low-temperature sintering, low void rate.
- High shear strength, high service temperature.
-
Single-component system, stored at
-5 to 10℃.
Summary
We provide a comprehensive solution for high-reliability packaging materials, ranging from traditional rosin-type/water-washable solder paste, to advanced formic acid-type (zero residue) and no-clean type (extremely low residue) solder paste, and then to cutting-edge nano-sintered copper paste. These product series precisely cover the stringent requirements of high-end manufacturing fields such as semiconductors, power devices, automotive electronics, and aerospace for ultra-low void rate, high thermal conductivity, high reliability, and process flexibility, dedicated to providing customers with excellent performance and cost-effective packaging technology support.
